-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
October 29, 2025 | WestDev Ltd.Estimated reading time: 1 minute
Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software. This integration provides PCB designers with an efficient, data-consistent workflow for advanced thermal simulation and verification.
As electronic systems become smaller and more powerful, managing heat flow is critical to ensuring performance and reliability. The new Pulsonix-TRM interface bridges the gap between PCB layout and thermal analysis, enabling engineers to identify and address potential thermal issues earlier in the design process.
Streamlined Data Exchange
The Pulsonix-TRM interface allows design data to be exported directly in a TRM-compatible format, maintaining layer stack information, copper areas, vias, and component power data with full accuracy. This eliminates the need for manual data translation, reducing setup time and the risk of errors. Designers can run TRM simulation analysis, and feed results back into the PCB layout for immediate evaluation using their original PCB design.
Powerful Thermal Insight
TRM provides advanced modelling of heat conduction through multilayer PCBs, including copper planes, vias, and heat-dissipating components. Using accurate material properties and board geometries, it calculates temperature distributions, thermal resistances, and hotspot locations-helping designers optimise copper areas, cooling paths, and component placement.
Benefits for Design Teams
Integrated workflow: Smooth transition between Pulsonix PCB design and TRM thermal analysis.
- Data integrity: No intermediate file editing or geometry loss.
- Early design validation: Thermal risks identified and resolved before prototype stage.
- Improved reliability: Better prediction of heat flow and temperature gradients.
“Thermal behaviour has become a key constraint in modern electronics,” said Bob Williams, Marketing Director at WestDev Ltd. “By linking Pulsonix directly with TRM, we're giving designers immediate access to accurate thermal insight-without leaving their familiar environment.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Coherent Expands Silicon Carbide Platform with 300mm Capability to Support Growing Demand of AI and Datacenters
12/04/2025 | Globe NewswireCoherent Corp., a global leader in photonics, announced a major milestone in its next-generation 300mm silicon carbide (SiC) platform to address increasing thermal efficiency demands in AI datacenter infrastructure.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.
Rubin’s Cableless Architecture and ASIC High-Layer HDI Designs Push PCBs to the Center of AI Compute Power
11/20/2025 | TrendForceTrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance.
Beyond Design: Micro-ohm Power Delivery Network for AI-driven GPUs
11/18/2025 | Barry Olney -- Column: Beyond DesignThe evolution of modern processors, marked by faster edge transitions, reduced output impedance, and increasingly complex bus architectures, has significantly augmented the demands on PCB infrastructure. These challenges are compounded by AI-driven graphics processing units (GPUs), which require exceptionally high-power delivery at ultra-low operating voltages, placing greater stress on power integrity and layout design.