Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Magneti Marelli Selects Goepel X-ray Inspection System
August 14, 2017 | GOEPEL ElectronicEstimated reading time: Less than a minute
Italian automotive supplier Magneti Marelli has decided on two X-ray inspection systems from Goepel electronic for quality assurance of electronic assemblies. At production sites in France and Slovakia, the X Line 3D systems are used to inspect high-complexity PCBs.
Electronic assemblies for automobiles are subject to particularly high quality requirements by the manufacturers. The X Line 3D is an inline X-ray system for high-end 3D inspection of non-visible or concealed solder joints in large-scale production. The three-dimensional X-ray inspection covers both top and bottom sides within a continuous process. The basis of this technology is real-time multi-angle image acquisition, which allows a complete 3D capture of the assembly. Integrated reconstruction methods provide detailed evaluation of the PCB under test, layer by layer.
Frédéric Preteseille in front of the X Line 3D at Magneti Marelli in Châtellerault Cedex, France
Goepel electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions:
- Automotive Test Solutions
- Embedded JTAG Solutions
- Industrial Function Test
- Inspection Solutions AOI·AXI·SPI·IVS
For more information, visit www.goepel.com.
Share on:
Suggested Items
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.