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Kurtz Ersa to Exhibit at SMTA International
August 15, 2017 | Kurtz Ersa Corp.Estimated reading time: 1 minute
Kurtz Ersa North America announces plans to exhibit in Booth #335 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois. Ersa’s team will demonstrate the HR 550 Rework system, Ersa Mobile Scope and i-CON VARIO 4.
The HR 550 hybrid rework system features a 1,500W high performance hybrid heating element to desolder and solder SMT components up to 70 x 70 mm. A 2,400 W infrared bottom heater in three heating zones guarantees homogeneous bottom-side preheating of the complete assembly. The system addresses all users with the highest requirements in terms of precision and process safety in electronic assembly rework applications.
The i-CON VARIO 4 offers whisper-quiet air and vacuum generation for up to four simultaneously operating soldering and de-soldering tools. The station ensures highly efficient processing of all SMT and THT soldering tasks. In addition to the 200W i-Tool AIR S, it offers the i-Tool Universal Soldering Device, the THT De-soldering X-tool Iron, and the Ultra-Fine De-soldering Chip Tool VARIO (2 x 40W).
The Ersa Mobile Scope has been designed for optical inspection and digital image recording including measurements of solder joints on Ball Grid Array (BGA), μBGA, CSP and Flip-Chip packages. Further applications are top-view inspection of PCB lands, solder paste prints or the optical inspection of components on printed circuit boards in Surface Mount Technology (SMT) or in Trough Hole Technology (THT). The device can be used in quality control, production, laboratories or R&D departments.
For more information about Kurtz Ersa North America, click here.
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