Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Alpha to Present on Tin-Copper Alloys and Flip Chip LEDs at SMTA China South Technical Conference
August 15, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will be presenting two technical papers at SMTA China South Technical Conference on August 30, 2017.
The first technical paper, titled “Comparing the Performance of Engineered Tin-Copper Alloys in Selective Soldering,” will be presented by Jackson Chan, Senior Technical Services Manager of Alpha Assembly Solutions Southern China. This paper details an experiment that compares the hole fill performance of two engineered tin-copper alloys in a selective soldering process. The test vehicle design incorporates features that are optimized for the selective soldering process. Two experiments are performed – one uses no preheat and no inner layer connections at the hole and the second uses preheat and thermally challenging inner layer connections. Engineered tin-copper solder is commonly chosen for use in RoHS-compliant selective soldering applications due to the cost advantage compared to silver-bearing alternatives. The added metals alloyed with eutectic tin-copper provide benefits that can differentiate various alloys in the tin-copper family.
The second paper, titled “Flip Chip LED Assembly by Solder Stamping Pin-Transfer,” will be presented by Vincent Liu, LED Application Engineer of Alpha Assembly Solutions in Taiwan. The paper will focus on displaying Alpha products dedicated for flip-chip LED die attach. These fine pitch capable materials (solder, sintered silver and conductive adhesives) have been put through LED packaging processes (like pin transfer / stamping and stencil printing – including 3D stencil, Dispensing etc) at Alpha’s dedicated LED packaging labs. LED packaging and LED module assembly makers who use flip chip for automotive, backlight and general lighting applications will find this presentation very relevant.
Date
Wednesday, August 30, 2017
Time
Paper 1: 10:30am - 11:05am
Paper 2: 14:55pm - 15:30pm
Venue
Booth 1T11, Hall 1, Shenzhen Convention & Exhibition Centre, Shenzhen, China
To learn more about Alpha Assembly Solutions’ vast product offering and capabilities, please visit www.AlphaAssembly.com.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.