-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
'Global Wisdom. Local Presence' Theme of HKPCA & IPC Show 2017
October 2, 2017 | HKPCA & IPCEstimated reading time: 4 minutes
The 2017 International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show) will again be staged at the Shenzhen Convention & Exhibition Center, China. This year’s edition will run from 6 to 8 December 2017. With the theme of “Global Wisdom. Local Presence,” it is hoped that global collective intelligence can be drawn to the show for assisting industry insiders to apply those high-end technologies into local production and hence enhance their business development.
Overwhelming response brings a record turnout of exhibitors
Demand for booth space at this year’s show has been spectacular. As of July, 97% of booth space has already been allocated, with a long waiting list for the few remaining booths. 501 exhibitors are confirmed to attend, across a massive exhibition space of over 52,500 sq.m. covering Halls 1, 2 & 4 of the Shenzhen Convention & Exhibition Center. The final number of exhibitors is expected to be close to 550, taking up more than 2,600 booths – a new record for the show, making this the largest edition ever.
As in past years, most of the industry’s leading players will be present, with confirmed names including TTM, Elec and Eltek, Gainbase, Sunshine, World Mastery, WKK, Atotech, Harvar, Schmoll, Rohm & Haas, Jadason, Orbotech, Han’s CNC, C Sun, Protek, Hitachi Chemical, Isola, Schmid, Rogers, Universal P.C.B., Joint Stars, Topoint, Rockent, Farcien, Guangdong Guanghua, Carl Zeiss, Dupont, Bluiris and many more. These familiar names, complementing with many first-time exhibitors, will bring fresh ideas and exciting new offerings to the show.
“We are delighted with this enthusiastic response, which reconfirms the HKPCA & IPC Show’s respected status as the industry’s most influential platform for sourcing and information and technology exchange,” said Dr. John W. Mitchell, President & CEO, IPC—Association Connecting Electronics Industries. “The impressive line-up of exhibitors will showcase a comprehensive array of new and innovative technologies, products and services. At the same time, the Fair will offer knowledge exchange and learning opportunities through the International Technical Conference and PCB Design Conference where industry experts will share in-depth knowledge and insights on the latest industry innovations and trends."
Hong Kong Pavilion introduces new insights to the show
A new highlight of the show this year is the Hong Kong Pavilion. Spreading over 100 sq.m. of a common area surrounded by PCB manufacturers’ booths, this will be partitioned into four regions showing PCB or semiconductor products and technology in four different product categories: communication, computers, consumer electronics and automobiles. The superb manufacturing technologies for high value-added features will be presented. Meanwhile, it is expected to show the HK PCB manufacturers’ international perspective and strong commitment to the social responsibility.
Mr. Canice Chung, Chairman of the Hong Kong Printed Circuit Association, remarked, “We are particularly pleased to see the appearance of the Hong Kong Pavilion this year which reflects Hong Kong’s pivotal role in setting new standards and directions for the industry. As the show brings together the elite of the global industry under one roof, the Pavilion adds a further dimension to the show’s important role in shaping the industry’s future.”
“Another important contribution to this mission is the numerous business and networking opportunities provided by the show. This year the PCB Design Competition plus the traditional Welcome Dinner and Golf Tournament will give participants plentiful chances to develop new business links and partnerships, as well as form new personal friendships, in a relaxed environment.”
About Hong Kong Printed Circuit Association (HKPCA)
HKPCA is a non-profit-making association which was founded in Hong Kong during 2000. Being one of the members of World Electronic Circuits Council (WECC), it helps us to get not only closer connections with overseas printed circuit associations but also better communications. Other WECC members include: CPCA, EIPC, IPC, IPCA, JPCA, KPCA and TPCA. As the unique representative of the Hong Kong PCB industry, we aim to promote and protect the rights and interests for the industry. Performing the communication liaison role within the industry, a diversified communication platform is provided by HKPCA so that our members can be closely linked. Also, HKPCA represents the industry expressing our ideas and opinions to the government and relevant organizations. HKPCA has more than 500 members. Total PCB production values reach around 9 billion dollars which occupy 34% of the PCB industry in China. Member categories differ from PCB manufacturers, PCB equipment, suppliers of chemicals and raw materials and other trade and software companies. HKPCA member base will be broadened by recruiting more and more qualified members. With all our efforts, the China PCB industry develops more prosperously. For more information, please visit www.hkpca.org.
About IPC – Association Connecting Electronics Industries (IPC) Since 1957
IPC—Association Connecting Electronics Industries® has been guiding the electronic interconnection industry through its dramatic changes. A global trade association dedicated to the competitive excellence and financial success of its more than 4,200 member companies, IPC represents all facets of the industry including design, printed board manufacturing, and electronics assembly and test, and suppliers to them. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. With global headquarters based in Bannockburn, Illinois, USA, IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium, Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao (China headquarters), Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China and Taipei.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Foxconn's Rotating CEO, Yang Qiujin, Named One of Asia's Most Influential Women
10/15/2025 | Foxconn ElectronicsHon Hai Precision Industry Co., Ltd.'s management team has once again received recognition! Rotating CEO Kathy Yang has been named to Fortune magazine's " Most Powerful Women Asia 2025 " list of the 100 most influential women in Asia , achieving a remarkable fifth place in her debut.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.