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Indium's Brook Sandy-Smith to Lead Warpage Discussion at SMTAI
August 17, 2017 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the SMTA International (SMTAI) 2017 Technical Conference on September 20 in Rosemont, Illinois.
The discussion, led by Sandy-Smith and Co-Chair Eric Moen of Akrometrix, LLC, will cover warpage induced defects and component warpage limits. Panel participants include Alex Chan, Nokia; Martin Anselm, Rochester Institute of Technology; Dudi Amir, Intel Corp.; and Neil Hubble, Akrometrix LLC.
The panel discussion is scheduled to start at 2 p.m. in the SMTAI Show Floor Theater. It will also be streamed live on Facebook. Go to www.facebook.com/indium for streaming details closer to the event date.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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