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Indium Features InFORMS Reinforced Solder Ribbon for Automated Assembly at IMAPS 2017
August 22, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at the IMAPS 50th Anniversary Symposium, which is scheduled for October 10–12, 2017, in Raleigh, North Carolina.
Indium is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that increases lateral strength, maintains bondline co-planarity, and improves thermal cycling reliability.
For more information about Indium Corporation, click here.
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