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MacDermid Alpha to Showcase SiC Power Module Technology at electronica 2026

11/03/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will exhibit at electronica 2026 (November 10–13, Messe München, Booth C2.654), showcasing its upcoming BondPad technology, an Argomax® film-laminated copper-foil solution for sintered die-topside attach in high-power, high-reliability silicon carbide (SiC) packages.

November SMT007 Magazine Explores the New Age of Sourcing

11/03/2026 | I-Connect007 Editorial Team
The November 2026 issue of SMT007 Magazine, “The New Age of Sourcing,” examines how EMS companies are gaining better visibility and control over purchasing, inventory, and supply chain costs. After years of disruption, sourcing teams are finding new ways to move beyond spreadsheets and put more complete, consistent information to work.

What AI Servers Are Asking of the PCB

10/29/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.
AI infrastructure is pushing PCB performance into new territory. As data rates move from 56 Gbps to 112, 224, 337 Gbps and beyond, the challenge isn't simply building more boards to support growing computing demand. Those boards also have to carry faster signals with less loss, often across increasingly complex, high-layer-count constructions. That puts new pressure on one of the most fundamental parts of the PCB: its materials.

When Does Reducing Silver Make Sense?

10/27/2026 | Senthil Kanagavel, MacDermid Alpha Electronics Solutions
There is a single decision at the center of every die-attach conversation right now that isn’t as much about chemistry as it is about control. This is most evident because silver prices have experienced significant volatility, evolving PFAS requirements are increasing regulatory and customer scrutiny, qualification windows are shrinking, and the packages that support AI, automotive, and power infrastructure must meet demanding performance and reliability requirements.

Flex Connections: Is a Printed Silver Ink Circuit Right for Your Application?

10/27/2026 | Terrill Schmidt -- Column: Flex Connections
When is the right time to design a flexible circuit with printed ink, usually silver, vs. a flexible etched copper circuit, a die-cut copper circuit, or a die-cut aluminum circuit? First, a flexible circuit design must work in the application as designed and be cost-effective so the end product can be sold or used. What drives a designer to choose between an etched copper circuit, printed ink, flat flexible cable, die-cut copper, or die-cut aluminum? Multiple factors influence the design.
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