Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Strong Demand for HANZA's MIG Advisory Service Driving More Strategic Manufacturing Partnerships

11/29/2024 | HANZA
HANZA, a leader in manufacturing solutions, continues to reap success with its advisory service within its overall concept MIG™ (Manufacturing solutions for Increased Growth and earnings).

Biden-Harris Administration: CHIPS Incentives Awards with BAE Systems and Rocket Lab

11/27/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

At Schneider Electric, Future of MES/MOM Lies in the Cloud

11/26/2024 | Schneider Electric
Schneider Electric’s mission is to be the trusted partner for sustainability and efficiency. The company is helping customers across industries unlock efficiency, productivity, and resilience through digital transformation. Schneider Electric is also accelerating its own digital transformation across production facilities.

Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab

11/25/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.

CIL Installs Third Volume Auto SMT Line with In-Line 3D AOI at BP2 Facility

11/25/2024 | CIL
In early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in