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Amerway Exhibiting High Purity Solder Products, Solutions at SMTAI 2017
August 25, 2017 | Amerway Inc.Estimated reading time: 1 minute
Amerway Inc. will be exhibiting a full range of premium solder products including solder bar, wire, fluxes, and custom alloys at SMTA International 2017, which will take place at the Donald E. Stephens Convention Center in Rosemont, Illinois, on September 17-21. Amerway will be in in Booth 1134.
In addition to their own premium products, Amerway also offers Balver Zinn Cobar Solder Products including the well-known lead-free SN100C family of alloys.
Amerway has also recently partnered with metals waste recycler Conecsus LLC to offer customers a 'cradle to grave' soldering solution, from Amerway high-purity soldering alloys and products to Conecsus waste recycling solutions for dross and other metals waste by-products from the SMT/PCB assembly process.
Balver Zinn Cobar SN100C is a nickel-stabilized tin copper eutectic, containing a small amount of germanium to reduce oxidation. SN100C generates bright and shiny solder joints, comparable with lead-containing solders. In 2005, NASA tests indicated that SN100C is the most reliable soft solder for wave soldering. SN100C is especially preferred for the higher process temperatures of selective soldering.
In making the announcement, Terry Buck, President, said, "Amerway Inc. recently awarded ISO 9001 quality certification, is pleased to offer Balver Zinn Cobar SN100C in addition to our own Amerway Inc. products. Our full range of soldering solutions, in addition to waste recycling programs with partner Conecsus, will be available in our booth at SMTAI this year."
About Amerway
Amerway Inc., based in Altoona, Pennsylvania, is a premier supplier of solder bar, solder wire, fluxes, and custom alloy products to the electronics manufacturing industry. Amerway manufactures a large selection of lead free alloys including pure tin, tin/copper, tin/antimony, tin/silver, SAC-alloys, fluxes, and more. Amerway Inc. has been recently awarded ISO 9001 quality certification, and now offers high-quality and high-purity Balver Zinn Cobar solder products such as fluxes, solder paste, and solder wire, including the SN100C family of alloys. For more information, click here.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.