Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Amerway Exhibiting High Purity Solder Products, Solutions at SMTAI 2017
August 25, 2017 | Amerway Inc.Estimated reading time: 1 minute
Amerway Inc. will be exhibiting a full range of premium solder products including solder bar, wire, fluxes, and custom alloys at SMTA International 2017, which will take place at the Donald E. Stephens Convention Center in Rosemont, Illinois, on September 17-21. Amerway will be in in Booth 1134.
In addition to their own premium products, Amerway also offers Balver Zinn Cobar Solder Products including the well-known lead-free SN100C family of alloys.
Amerway has also recently partnered with metals waste recycler Conecsus LLC to offer customers a 'cradle to grave' soldering solution, from Amerway high-purity soldering alloys and products to Conecsus waste recycling solutions for dross and other metals waste by-products from the SMT/PCB assembly process.
Balver Zinn Cobar SN100C is a nickel-stabilized tin copper eutectic, containing a small amount of germanium to reduce oxidation. SN100C generates bright and shiny solder joints, comparable with lead-containing solders. In 2005, NASA tests indicated that SN100C is the most reliable soft solder for wave soldering. SN100C is especially preferred for the higher process temperatures of selective soldering.
In making the announcement, Terry Buck, President, said, "Amerway Inc. recently awarded ISO 9001 quality certification, is pleased to offer Balver Zinn Cobar SN100C in addition to our own Amerway Inc. products. Our full range of soldering solutions, in addition to waste recycling programs with partner Conecsus, will be available in our booth at SMTAI this year."
About Amerway
Amerway Inc., based in Altoona, Pennsylvania, is a premier supplier of solder bar, solder wire, fluxes, and custom alloy products to the electronics manufacturing industry. Amerway manufactures a large selection of lead free alloys including pure tin, tin/copper, tin/antimony, tin/silver, SAC-alloys, fluxes, and more. Amerway Inc. has been recently awarded ISO 9001 quality certification, and now offers high-quality and high-purity Balver Zinn Cobar solder products such as fluxes, solder paste, and solder wire, including the SN100C family of alloys. For more information, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.