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Indium Features Indium3.2HF Solder Paste for Fine Feature Printing at SEMICON Taiwan
August 28, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2017 in Taipei, Taiwan.
Indium Corporation’s Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).
Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:
- Good response-to-pause
- Wide reflow profile window
- Outstanding slump resistance
- Excellent wetting capability
- Superior fine-pitch soldering ability
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.
For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, go to www.indium.com/SiP or visit Indium Corporation’s booth 2412.
For more information about Indium Corporation, click here.
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