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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Mentor to Hold Webinar on FloTHERM V12
August 30, 2017 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Byron Blackmore, product manager for electronics cooling at Mentor, will present the benefits of the new features in FloTHERM v12 in a webinar scheduled on September 21, 2017.
The webinar will feature the new functionality of FloTHERM, including a new and improved Command Center, and ho these new features can help increase your productivity. There will be an opportunity to ask questions at the end of the presentation.
You will also learn how to:
- Easily create, solve, and analyse model variants to fully explore and improve the thermal design.
- Copy/Paste data exchange with external tools, makes interaction and report generation quicker.
- Support for Phase Change Materials (PCM). Encapsulated PCMs have become a common thermal solution for consumer applications, and have been difficult to simulate in the past. FloTHERM now accepts latent heat and melt temperature as inputs and utilizes these values automatically in transient applications. The impact of PCMs on component and touch temperatures can now be fully explored and optimized in FloTHERM.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
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The Knowledge Base: The Era of Advanced Packaging
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Overview of Soldering Systems With Vacuum
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