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Aismalibar to Attend APEC 2024

02/15/2024 | Aismalibar
Aismalibar will be attending the APEC, the leading conference for practicing power electronics professionals, in Long Beach, California from February 25th to 29th, 2024 in Booth 552. Aismalibar will be presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and Insulated Metal Substrates (IMS).

Indium Corporation Advisor to Present, Host Tutorial at TestConX 2024

02/14/2024 | Indium Corporation
Indium Corporation advisor, and founder/principal of DS&A LLC, Dave Saums will present on innovative thermal materials for semiconductor testing at TestConX 2024, held in Mesa, AZ, March 3-6.

KIC to Discuss Revolutionary Contact-less Thermal AnalysisTM at SMTA Dallas Expo and Tech Forum

02/09/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, will exhibit its latest breakthrough technology, Contact-less Thermal AnalysisTM, at the SMTA Dallas Expo and Tech Forum.

Kerafol, X2F Partner to Revolutionize Thermal Solutions for Electronic Devices

02/09/2024 | Kerafol
Kerafol and X2F are teaming up to develop state-of-the-art thermal management solutions for electronic devices by leveraging the advantages of Kerafol's thermally conductive materials and X2F's patented controlled-viscosity molding technologies.

Cadence Advances ECAD/MCAD Convergence with Celsius Studio AI Thermal Platform

02/01/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced Cadence® Celsius™ Studio, the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies.
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