-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Mek SPI Features Simultaneous 2D and 3D Inspection Capabilities
September 4, 2017 | Mek (Marantz Electronics)Estimated reading time: 2 minutes

Mek (Marantz Electronics) has launched its latest automated solder paste inspection (SPI) system—the Model S2—which features patented third generation sensor technology that enables unique, simultaneous 2D and 3D inspection. It will be on display for the first time at Productronica in Munich, Hall A2 Booth 402.
The new ISO-Spector S2 utilizes the latest in 12 Mega Pixel camera technology. A fibre optic link allows for a 32 gigabit image data transfer speed.
The S2 delivers the highest quality 2D colour imaging using Episcopic and low angle diffuse RGB lighting systems that remove all specular reflections from solder fluxes and solder mask. Shadow free violet/blue dual lasers provide precise and repeatable 3D images. Available with standard resolution of 18/9µm lens resolution for inspection down to 01005 pad geometries or optionally with 12/6µm for pad geometries down to 008004. On the fly resolution switching allows the efficient inspection of mixed technology PCB’s.
Synthetic color imaging allows the simplification of color extraction of solder mask, silk screen and solder and isolates the solder to be measured, even below zero reference.
The S2 moves SPI forwards from a means of process control to one of production control. Using the Mek S2 and the real-time feedback provided by the SPC-One SPC package the user can narrow tolerances in the print process by adopting automatically to the actual process capability, bringing the real world of printing into its tolerances. Tighter tolerances over the whole PCB, enable the user to monitor process drift which was previously difficult or impossible to capture. This process is especially useful for users of jet style paste printers. The S2 can quickly adjust to changes made in the jetting program without completely reprogramming the inspection parameters. Variations in the jet printing process are immediately visible and fed back.
SPI equipment is essential to monitor and control the most critical, error prone process step in manufacturing defect-free electronic assemblies; solder paste printing. The interception of print defects reduces rework costs, delivers instant yield improvement and accelerates ROI.
About Mek (Marantz Electronics Ltd)
A former division of Marantz well known for its high quality Audio/Video products, Mek Japan (Marantz Electronics Kabushiki Kaisha), developed its first AOI system in 1994. Developed to inspect PCB assemblies for correct component placement and soldering, the company’s original AOI system was designed for use in Marantz factories. Proving to be a highly successful, cost-effective alternative to traditional human inspection, Mek developed its first generation commercial system in 1996. With a steadily growing installed base, MEK Japan and its European/American headquarters, Mek, have sold over 6000 units worldwide to date. Now well established as a leading force in AOI technologies, the company also manufactures a 5D post-print SPI system which combines 3D and 2D image processing methodologies to deliver unprecedented defect detection. At the beginning of March 2014 the company opened US offices in Las Vegas.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.