-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Mek SPI Features Simultaneous 2D and 3D Inspection Capabilities
September 4, 2017 | Mek (Marantz Electronics)Estimated reading time: 2 minutes

Mek (Marantz Electronics) has launched its latest automated solder paste inspection (SPI) system—the Model S2—which features patented third generation sensor technology that enables unique, simultaneous 2D and 3D inspection. It will be on display for the first time at Productronica in Munich, Hall A2 Booth 402.
The new ISO-Spector S2 utilizes the latest in 12 Mega Pixel camera technology. A fibre optic link allows for a 32 gigabit image data transfer speed.
The S2 delivers the highest quality 2D colour imaging using Episcopic and low angle diffuse RGB lighting systems that remove all specular reflections from solder fluxes and solder mask. Shadow free violet/blue dual lasers provide precise and repeatable 3D images. Available with standard resolution of 18/9µm lens resolution for inspection down to 01005 pad geometries or optionally with 12/6µm for pad geometries down to 008004. On the fly resolution switching allows the efficient inspection of mixed technology PCB’s.
Synthetic color imaging allows the simplification of color extraction of solder mask, silk screen and solder and isolates the solder to be measured, even below zero reference.
The S2 moves SPI forwards from a means of process control to one of production control. Using the Mek S2 and the real-time feedback provided by the SPC-One SPC package the user can narrow tolerances in the print process by adopting automatically to the actual process capability, bringing the real world of printing into its tolerances. Tighter tolerances over the whole PCB, enable the user to monitor process drift which was previously difficult or impossible to capture. This process is especially useful for users of jet style paste printers. The S2 can quickly adjust to changes made in the jetting program without completely reprogramming the inspection parameters. Variations in the jet printing process are immediately visible and fed back.
SPI equipment is essential to monitor and control the most critical, error prone process step in manufacturing defect-free electronic assemblies; solder paste printing. The interception of print defects reduces rework costs, delivers instant yield improvement and accelerates ROI.
About Mek (Marantz Electronics Ltd)
A former division of Marantz well known for its high quality Audio/Video products, Mek Japan (Marantz Electronics Kabushiki Kaisha), developed its first AOI system in 1994. Developed to inspect PCB assemblies for correct component placement and soldering, the company’s original AOI system was designed for use in Marantz factories. Proving to be a highly successful, cost-effective alternative to traditional human inspection, Mek developed its first generation commercial system in 1996. With a steadily growing installed base, MEK Japan and its European/American headquarters, Mek, have sold over 6000 units worldwide to date. Now well established as a leading force in AOI technologies, the company also manufactures a 5D post-print SPI system which combines 3D and 2D image processing methodologies to deliver unprecedented defect detection. At the beginning of March 2014 the company opened US offices in Las Vegas.
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).