Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Excellon Installs HS-2L Intelli-Drill System at Bay Area Circuits
September 12, 2017 | ExcellonEstimated reading time: 1 minute
Excellon announces the installation of an HS-2L Intelli-Drill System at Bay Area Circuits, Inc. of Fremont, California.
The Excellon HS-2L Intelli-Drill System provides capabilities such as post lamination tooling optimization for multi-layers, zone drilling and routing relative to surface targets and features such as surface sense depth control and reverse spindle rotation that set it apart from the competition. The fast and accurate axis positioning system uses linear motor technology making quick work of large panels up to 28 by 32 inches.
“We are excited with the addition of the HS-2L to Bay Area Circuits current drill process. Having the flexibility of another Intelli-Drill Vision System with the added two spindles will enhance the technology and turn-around time of complex PCB's,” said Stephen Garcia, president, Bay Area Circuits.
Mike Sparidaens, vice president of sales at Excellon, stated: "Having partnered with Bay Area Circuits since the 1970's Excellon looks forward to the implementation of the HS-2L Intelli-Drill System as well as being a part of Bay Area Circuit's high technology facility for years to come.”
About Bay Area Circuits, Inc.
Bay Area Circuits, Inc., has been serving the PCB needs of high-tech electronics manufacturers, contract assemblers, and design engineers for over 40 years. Located in the heart of Silicon Valley, Bay Area Circuits’ focus on high quality, quick-turn prototyping has enabled the company to become a premiere PCB supplier for discerning customers around the world. More information about Bay Area Circuits can be found by visiting the company's website.
About Excellon
Excellon, an employee-owned company, is recognized worldwide as a leader in installed PCB Drilling systems with products ranging from single and multiple station mechanical drilling machines to hybrid laser precision via formation and routing systems. Proudly designed and manufactured in the U.S.A. Click here for more information.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.