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RTW NEPCON South China: Rehm on Machine Communications and Vacuum Technology in Reflow
September 13, 2017 | Real Time With... NEPCON South ChinaEstimated reading time: Less than a minute
Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, speaks with I-Connect007 Managing Editor Stephen Las Marias during the recent NEPCON South China event in Shenzhen about the need for a common communications platform or interface as the industry moves toward Industry 4.0. He talks about how their new ViCON software can help manufacturers achieve the smart factory vision.
Wagenfuehr also discusses how vacuum technology helps eliminate voiding in reflow soldering.
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SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
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Altus Supplies Dual Lane Reflow Oven to Triple CEM’s Production Capacity
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Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
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YINCAE Launches UF 120LA
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