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Creative Materials Unveils One-Component B-Stageable Epoxy Adhesives
September 15, 2017 | Creative Materials, Inc.Estimated reading time: 1 minute
Creative Materials, Inc., highlights our series of one-component B-stageable epoxy adhesives, developed for a wide variety of applications, including printed circuit board fabrication, advanced material composite structures, wafer-bonding, and heat sink applications. Versions of these products include our 125-22 and 125-22-F, silver-filled epoxy and epoxy film, designed with minimal flow and low-CTE properties for applications where ingress into cavities or vias is unacceptable. Other products, 118-06 and 118-06-F, electrically conductive adhesives, are customized for ground plane bonding and die attach applications. Our 122-07 and 122-07-F are useful for electrical insulation and heat dissipation requirements, such as heat spreader bonding and chip/module attachment. Finally, our 124-07 and 124-07-F, are designed for hermetic sealing, lid attachment, and other non-conductive laminating adhesive solutions.
These products are suited to a wide variety of application processes including screen- printing, film transfer, syringe-dispensing, stencil printing, pad printing, and pin transfer.
Products from Creative Materials are used in a variety of applications that provide cost-effective design solutions for demanding production requirements. Creative Materials is ISO 9001 and ISO 14001 certified. The company has extensive experience in the functional adhesive, ink and coating industry, combining technical expertise with nimble production capabilities, enabling a reduction in time-to-market for new product applications. We specialize in custom developed products. We ask our customers to challenge us to develop the right product for their application.
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