-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Yamaha Motor Launches High-end Hybrid AOI System
September 19, 2017 | Yamaha Motor IMEstimated reading time: 2 minutes

Yamaha Motor Europe IM has launched the YSi-V 12M TypeHS2 high-end hybrid AOI system. As the successor to the YSi-V 12M TypeHS, this new very high-speed specification model features increased speed and precision, as well as enhanced specular component inspection capacity/performance.
Development of the YSi-V 12M TypeHS2 aimed for faster processing through improved image processing hardware and image inspection algorithms, and has achieved a more than a 20% increase in three-dimensional inspection speed compared to the existing model. In particular, the new model delivers a significant speed increase of approximately 40% compared to the existing model in printed circuit boards (PCBs) with many component mounting points.
New features include a high-precision mode, enabling capture of clear three-dimensional images. The high-precision 7 μm resolution type includes an all-new-design dedicated three-dimensional image capture projector optical system, significantly improving form reproducibility of extremely small-sized components down to 0201 (0.25 x 0.125mm), and increasing height measurement repeatability.
Furthermore, the optimization of image capture parameters and the employment of newly-developed algorithms has enabled inspection capacity/performance compatible with thin, highly-integrated WLCSP and FOWLP components, whose use on the market has risen dramatically since last year.
The YSi-V 12M TypeHS2 will be showcased at Productronica 2017, an electronics manufacturing and mounting technology exhibition to be held from November 14–17, 2017 in Munich, Germany.
About Yamaha Motor IM
Yamaha Motor IM is a subdivision of Yamaha Motor Corporation. Yamaha IM surface mounters are highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts being mounted on circuit boards.
Yamaha Motor IM has created a strong business in the surface mounter industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers. This allows Yamaha Motor IM to offer a full line of machines for electric/electronic parts mounting and
propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.
Yamaha Motor IM has sales and service offices in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients. For more information, click here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.