The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Viscom Adopts Valor Process Preparation Solution for Electronics Manufacturing Efficiency
September 20, 2017 | Viscom AGEstimated reading time: 2 minutes
Viscom AG has announced the adoption of the Valor Process Preparation technology from Mentor, a Siemens business, for its Viscom vVision SPI and AOI systems. Recognized globally for providing superior 3D optical and X-ray inspection systems for electronics manufacturing, Viscom is seeing important benefits in using this additional tool. When combined with Valor Process Preparation software, the efficiency of the machines is significantly enhanced.
One of the more challenging tasks of operating AOI machines is the creation of robust inspection algorithms for new and non-standard parts that have not been inspected on previous boards. Even for medium-sized boards, it can take some additional time to create a program with new parts. And for large designs, this additional effort can be significant. The combination of Viscom vVision and Valor Process Preparation creates a solution for this challenge.
The rules-driven auto-generation capability of Valor Process Preparation can create the regions of interest that the vVision machine needs to apply the optimum inspection algorithms. This data is usually created manually, which may delay the introduction of new parts. The Valor Parts Library (VPL) comprises shape geometries based on manufacturing part numbers (MPNs) from a central database.
The vVision inspection content also can be provided from the SMT placement libraries. All shapes are kept in a neutral format that can then be generated into machine-specific shapes using the Valor auto-generate feature, including those of ASM, Fuji, Juki, Panasonic and Yamaha, providing the Viscom vVision machine with a rich data set of PCB footprint and component package information. This significantly reduces the time to create inspection templates for new parts.
"Our proven Valor Process Preparation product will enhance the yield and productivity of Viscom's customers so we are honored that our technology is being utilized in the vVision AOI and SPI systems," says Dan Hoz, general manager of the Valor Division of Mentor. "We expect that customers using Viscom’s machines will realize immediate productivity gains to meet competitive first-to-market goals."
"The Valor tool and its package library are invaluable for further speeding up managing new parts," says Detlef Beer, senior manager of product engineering, Viscom. "Our initial test results show that using Valor Process Preparation will reduce time on the machine to help our customers manufacture their electronics products with improved speed and efficiency."
About Viscom
Viscom AG manufactures and sells high-quality automatic optical and X-ray inspection systems. The company is one of the leading suppliers of 3D solder paste inspection, component placement and solder joint inspection equipment in the PCB assembly market. Viscom systems ensure quality in surface mount technology production lines, where they can be interlinked to further improve productivity. The company’s headquarters and manufacturing operation is located in Hanover, Germany. With a wide network of branches, applications and service centers, Viscom is represented throughout Europe, Asia and the Americas. Founded in 1984, Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867) since 2006. For more information, click here.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.