Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Viscom Adopts Valor Process Preparation Solution for Electronics Manufacturing Efficiency
September 20, 2017 | Viscom AGEstimated reading time: 2 minutes
Viscom AG has announced the adoption of the Valor Process Preparation technology from Mentor, a Siemens business, for its Viscom vVision SPI and AOI systems. Recognized globally for providing superior 3D optical and X-ray inspection systems for electronics manufacturing, Viscom is seeing important benefits in using this additional tool. When combined with Valor Process Preparation software, the efficiency of the machines is significantly enhanced.
One of the more challenging tasks of operating AOI machines is the creation of robust inspection algorithms for new and non-standard parts that have not been inspected on previous boards. Even for medium-sized boards, it can take some additional time to create a program with new parts. And for large designs, this additional effort can be significant. The combination of Viscom vVision and Valor Process Preparation creates a solution for this challenge.
The rules-driven auto-generation capability of Valor Process Preparation can create the regions of interest that the vVision machine needs to apply the optimum inspection algorithms. This data is usually created manually, which may delay the introduction of new parts. The Valor Parts Library (VPL) comprises shape geometries based on manufacturing part numbers (MPNs) from a central database.
The vVision inspection content also can be provided from the SMT placement libraries. All shapes are kept in a neutral format that can then be generated into machine-specific shapes using the Valor auto-generate feature, including those of ASM, Fuji, Juki, Panasonic and Yamaha, providing the Viscom vVision machine with a rich data set of PCB footprint and component package information. This significantly reduces the time to create inspection templates for new parts.
"Our proven Valor Process Preparation product will enhance the yield and productivity of Viscom's customers so we are honored that our technology is being utilized in the vVision AOI and SPI systems," says Dan Hoz, general manager of the Valor Division of Mentor. "We expect that customers using Viscom’s machines will realize immediate productivity gains to meet competitive first-to-market goals."
"The Valor tool and its package library are invaluable for further speeding up managing new parts," says Detlef Beer, senior manager of product engineering, Viscom. "Our initial test results show that using Valor Process Preparation will reduce time on the machine to help our customers manufacture their electronics products with improved speed and efficiency."
About Viscom
Viscom AG manufactures and sells high-quality automatic optical and X-ray inspection systems. The company is one of the leading suppliers of 3D solder paste inspection, component placement and solder joint inspection equipment in the PCB assembly market. Viscom systems ensure quality in surface mount technology production lines, where they can be interlinked to further improve productivity. The company’s headquarters and manufacturing operation is located in Hanover, Germany. With a wide network of branches, applications and service centers, Viscom is represented throughout Europe, Asia and the Americas. Founded in 1984, Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867) since 2006. For more information, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.