Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
SMART Group and NPL Host Process, Design & Reliability Seminar
September 25, 2017 | SMART GroupEstimated reading time: 1 minute
SMART Group announces that it is co-sponsoring the Process, Design & Reliability Seminar on 9 November with the NPL.
The full-day event will take place at the NPL facility in Teddington, UK, and will showcase the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, high-temperature reliability for alternative solders and substrates materials.
Presentation topics include the following:
- Whisker Mitigation: 1000 Days of Testing to Evaluate Conformal Coatings
- Performance and Lifetime of Printed Semiconductors
- Condensation Failure and Improved Testing for Electronic Assemblies
- High-Temperature Electronics and Their Reliability
- Factors Affecting Moisture Diffusion in PCBs
- UV Non-Destructive Coating Thickness Measurement System
- Coatings for High-Temperature Applications
- Effect of Production Process and Laminate Materials on Conductive Anodic Filament (CAF) Failure
- Best Methods to Evaluate Assembly Reliability
- How to Test and What to Expect in Terms of Failure with Different Test Methods
Each attending delegate will have the opportunity to access the Groups Report Database to download free reports on many of the projects
To book a place and for further information about the seminar, click here. To book a tabletop exhibition space, click here. Additionally, for further information about either the exhibition or the seminar, email Keith Bryant at info@smartgroup.org.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.