Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
SMART Group and NPL Host Process, Design & Reliability Seminar
September 25, 2017 | SMART GroupEstimated reading time: 1 minute
SMART Group announces that it is co-sponsoring the Process, Design & Reliability Seminar on 9 November with the NPL.
The full-day event will take place at the NPL facility in Teddington, UK, and will showcase the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, high-temperature reliability for alternative solders and substrates materials.
Presentation topics include the following:
- Whisker Mitigation: 1000 Days of Testing to Evaluate Conformal Coatings
- Performance and Lifetime of Printed Semiconductors
- Condensation Failure and Improved Testing for Electronic Assemblies
- High-Temperature Electronics and Their Reliability
- Factors Affecting Moisture Diffusion in PCBs
- UV Non-Destructive Coating Thickness Measurement System
- Coatings for High-Temperature Applications
- Effect of Production Process and Laminate Materials on Conductive Anodic Filament (CAF) Failure
- Best Methods to Evaluate Assembly Reliability
- How to Test and What to Expect in Terms of Failure with Different Test Methods
Each attending delegate will have the opportunity to access the Groups Report Database to download free reports on many of the projects
To book a place and for further information about the seminar, click here. To book a tabletop exhibition space, click here. Additionally, for further information about either the exhibition or the seminar, email Keith Bryant at info@smartgroup.org.
Share on:
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).