Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Alpha to Present on LED Products at Lighting Technology Show
September 26, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will be presenting information on its LED products for die attach and assembly at the Future Lighting Workshop at the Lighting Technology show on October 10 in Essen, Germany.
Ralph Christ, CTS Manager for DACH Europe for Alpha Assembly Solutions, a MacDermid Performance Solutions Business, will present two topics at the workshop. The first topic, "Thermal and Optical Characterization of LED Die Attach Materials", will focus on the effects of using die attach materials in high-power LEDs.
High-power LEDs generate significant heat, that if not efficiently removed from the assembly, leads to lower luminous flux and lower operating efficiency. As most of the heat is transported through the die attach layer, the thermal resistance of the heat path significantly impacts the overall device performance. Higher thermal conductivity die attach materials significantly decrease the thermal resistance of an LED stack. The presentation will show the results of a laboratory study carried out by Alpha showing the comparative performance of identical LEDs assembled with a variety of die attach materials.
The second topic, "LED Assembly on Flexible Substrates", will provide an insight into the world of LEDs on flexible circuits. The presentation will cover end-applications and drivers for LEDs on flex substrates. These include solder alloys and substrate material selection, details of low to mid temperature alloys and interconnects and both polyimide and PET based substrates. Additionally, the impact and performance of typical solder/substrate material stacks in the form of applications and the evolution of flexible circuitry in new formable factors will be discussed.
To register for the event please click here.
Lighting Technology – Future Lighting Workshops
Date: Tuesday 10 October 2017
Time: 1st Topic: 15:30pm – 16:15pm, 2nd Topic 17:00 – 17:45pm
Venue: Messe Essen, Congress Center South, Entrance Fair South Norbertstraße, 45131 Essen, Germany
1st Topic: Thermal and Optical Characterization of LED Die Attach Materials
Presented by: Ralph Christ, CTS Manager for DACH Europe, Alpha Assembly Solutions
2nd Topic: LED Assembly on Flexible Substrates
Presented by: Ralph Christ, CTS Manager for DACH Europe, Alpha Assembly Solutions
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.