-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Alpha to Present on LED Products at Lighting Technology Show
September 26, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will be presenting information on its LED products for die attach and assembly at the Future Lighting Workshop at the Lighting Technology show on October 10 in Essen, Germany.
Ralph Christ, CTS Manager for DACH Europe for Alpha Assembly Solutions, a MacDermid Performance Solutions Business, will present two topics at the workshop. The first topic, "Thermal and Optical Characterization of LED Die Attach Materials", will focus on the effects of using die attach materials in high-power LEDs.
High-power LEDs generate significant heat, that if not efficiently removed from the assembly, leads to lower luminous flux and lower operating efficiency. As most of the heat is transported through the die attach layer, the thermal resistance of the heat path significantly impacts the overall device performance. Higher thermal conductivity die attach materials significantly decrease the thermal resistance of an LED stack. The presentation will show the results of a laboratory study carried out by Alpha showing the comparative performance of identical LEDs assembled with a variety of die attach materials.
The second topic, "LED Assembly on Flexible Substrates", will provide an insight into the world of LEDs on flexible circuits. The presentation will cover end-applications and drivers for LEDs on flex substrates. These include solder alloys and substrate material selection, details of low to mid temperature alloys and interconnects and both polyimide and PET based substrates. Additionally, the impact and performance of typical solder/substrate material stacks in the form of applications and the evolution of flexible circuitry in new formable factors will be discussed.
To register for the event please click here.
Lighting Technology – Future Lighting Workshops
Date: Tuesday 10 October 2017
Time: 1st Topic: 15:30pm – 16:15pm, 2nd Topic 17:00 – 17:45pm
Venue: Messe Essen, Congress Center South, Entrance Fair South Norbertstraße, 45131 Essen, Germany
1st Topic: Thermal and Optical Characterization of LED Die Attach Materials
Presented by: Ralph Christ, CTS Manager for DACH Europe, Alpha Assembly Solutions
2nd Topic: LED Assembly on Flexible Substrates
Presented by: Ralph Christ, CTS Manager for DACH Europe, Alpha Assembly Solutions
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.