-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Datest to Discuss Its Latest Acquisition at NEDME / OctoberBest
September 27, 2017 | DatestEstimated reading time: 2 minutes
Datest will exhibit at the Northwest Electronics Design and Manufacturing Expo (NEDME, a.k.a. OctoberBest), scheduled to take place Wednesday, Oct. 4, 2017 at Tektronix in Beaverton, Oregon. Robert Boguski and Regina Lathrop from Datest will discuss the company’s testing, engineering and PCB reverse engineering services, and value-added services including:
- Bonepile Rehabilitation Services
- 3D and CT-Scan X-ray/Failure Analysis Service
- Improved and enhanced flying probe test services
- Improved and enhanced in-circuit testing services
Datest will give attendees a preview of its latest equipment acquisition – a 225kV custom-made VJ Technologies advanced digital radiographic inspection imaging system. This system will provide Datest with a reliable high precision Micro Focus X-ray inspection platform for numerous failure analysis, materials science, metrology and inspection applications. The system will go live at the end of 2017.
Additionally, Datest will discuss its extensive lab services, including XRF, SEM-EDX, Dye & Pry, cross-sectioning and C-SAM. An ISO9001- and AS9100-certified company, Datest has been providing the CM/EMS as well as the OEM community with advanced, integrated PCBA testing and inspection services since 1984. The company offers in-circuit testing (ICT) and test development (hardware and software) for all major ICT platforms (Agilent 3070, GenRad, and Teradyne).
Datest augments ICT with SPEA Flying Probe testing, Agilent 5DX and Nordson DAGE Ruby 2D X-ray with X-Plane Technology, benchtop boundary scan and functional testing. Datest also offers a wide ecosystem of partner companies providing complimentary laboratory, test and failure analysis services.
NEDME brings engineers, entrepreneurs and purchasing professionals together with local and regional suppliers who can help them develop innovative products and services within the electronics manufacturing industry. Attendees and exhibitors benefit from valuable keynotes and technical sessions. NEDME contributes 100 percent of net entrance proceeds to the Oregon Food Bank.
About Datest
Datest is the preeminent provider of advanced, efficient, and cost-effective PCBA testing, test engineering, failure analysis and analytical solutions. Established in 1984, Datest now offers in-circuit and flying probe testing and development services; DFT/DFM analysis; JTAG/Boundary Scan development services; AXI as well as 2D and 3D X-ray and CT-scan capabilities for nondestructive failure analysis, root cause identification, and dispute resolution. The company also offers cross-sectioning, dye & pry, and analytical laboratory services, including SEM and C-SAM analysis; counterfeit component identification and detection; and reverse engineering services. Datest is ITAR registered and has a quality management system (QMS) that is certified to ISO9001 and AS9100C. For more information click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
AV Switchblade 600 Loitering Munition System Achieves Pivotal Milestone with First-Ever Air Launch from MQ-9A
09/12/2025 | BUSINESS WIREAeroVironment, Inc. (AV) a global leader in intelligent, multi-domain autonomous systems, announced its Switchblade 600 loitering munition system (LMS) has achieved a significant milestone with its first-ever air launch from an MQ-9A Reaper Unmanned Aircraft System (UAS).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.