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Dr. Jennie Hwang to Present on Package/Board Level Integrity & Solder Joint Reliability at IMAPS 2017
September 27, 2017 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: Less than a minute
Industry expert Dr. Jennie S. Hwang will leverage her decades of extensive real-world experiences and deep knowledge to present on package and board level integrity, as well as solder joint reliability, at the upcoming IMAPS 2017 symposium, to be held from October 9–12, 2017 in Raleigh, North Carolina.
With the goal to produce reliable products while achieving high yield production, this short course provides a holistic overview of product reliability and of critical players of the package/board level integrity and solder joint reliability, including the roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. Recent developments related to lead-free solder materials and the prevention of PCB laminates issues, tin whisker and intermetallics-related concerns in relation to manufacturability and reliability will be outlined.
The short course emphasizes on practical, working knowledge, yet balanced and substantiated by science. Interactions are encouraged, and attendees are welcome to bring their own selected systems for deliberation.
For more information or to register, click here.
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