Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Ventec's Thermal Management Material Driving Today's Automotive Lighting Technology
September 28, 2017 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group, a world leader in the production of insulated metal substrates, thermally conductive, polyimide & high reliability laminates and prepregs, will be exhibiting its latest thermally conductive material innovations at the Ford Advanced Lighting Innovation Expo (ALIE) on October 3-4, 2017 in Dearborn, Michigan. On booth #7 of the Ford Product Research Development Center (PDC), Ventec will present its next generation best-in-class, high Tg thin-core and prepreg material and B-series insulated metal backed substrates designed for today's most thermally demanding PCB applications.
Ventec will be introducing VT-5A2 at the expo, which sets itself apart by offering highest performance thermal conductivity 8 times that of FR4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 Minutes, T288 >30 Minutes and T300 >15 Minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfils RoHS and WEEE requirements and complies with UL94 V0. This material has been developed for a range of thermally demanding automotive applications.
Automotive manufacturers around the world, including Ford, Tesla, VAG, Audi, Skoda, Seat, Volkswagen, Tata, Bentley, Daimler Benz, BMW, Renault-Nissan, Jaguar/Land Rover, Maclaren Automotive, already rely on Ventec's thermal management materials for a range of applications including LED headlights, ECU, break energy reclamation & e-power train establishing Ventec as a global leader in technology for high performance thermal management materials.
Ventec's state-of-the-art IMS production facility has fully automated 100% inline hi pot testing, guaranteeing the integrity of the performance-critical ultrathin dielectric layer. With industry leading production capacity of >3 million IMS panels per annum, of which the VT-4B series alone is 1.9 million panels per year, and with a 50% capacity increase planned in 2018, Ventec is well placed to meet the forecast growth in demand from the automotive and other sectors, with leading edge technology and quality.
With unrivalled lead-times as short as 3 days ex works Suzhou, and a global network of service and distribution centers, Ventec is well placed to support QTA prototyping & pre-production, through to series production in all regions with a fully controlled and managed global supply chain, sales- and technical support-network.
Ventec's thermally conductive materials are manufactured using strict quality controlled processes that are certified to ISO/TS16949, ISO 9001:2015 and AS9100.
"Our industry-leading advanced thermal management materials provide us with a clear competitive advantage in the automotive market," says Jack Pattie, President Ventec International (USA). "We are looking forward to Ford ALIE 2017 and are confident that with our thermal management solutions along with expert advice from our team, visitors to the expo will discover that Ventec offers the most suitable product for their particular application."
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.