-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Alpha to Continue Focus on Void Reduction & Low Temperature Solutions at SMTA in Guadalajara, Mexico
September 28, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be exhibiting and giving a featured presentation at the 2017 SMTA Mexico Conference and Exhibition on October 18 – 19 at the Hotel Riu Plaza, Guadalajara, Mexico.
At the show, Alpha will feature its latest void reduction and low temperature assembly process technology solutions. Two products to be highlighted during the show as part of these solutions are the innovative void reduction ALPHA AccuFlux BTC-578 Preform System and a new low temperature solder paste, ALPHA OM-550.
“Alpha has developed a reliable low void technology system for bottom terminated components.“ Said Jerry Sidone, Product Manager for Engineered Materials at Alpha Assembly Solutions. “The ALPHA® AccuFlux™ BTC-578 Preform System has been specially designed to dramatically decrease voiding, an issue of increasing importance as power densities continue to rise and managing thermal reliability becomes more of a challenge.“
Alpha recently launched its new ALPHA® OM-550 low temperature solder paste. “We are very excited about the performance of OM-550. It is a low temperature solution for customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy,“ said Robert Wallace, Regional Marketing Manager for the Americas. “This paste provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability compared to other low temp alloys.“In addition, Alpha will deliver one of the featured presentations during the conference. Mitch Holtzer, Director of Alpha’s Reclaim Business, will be presenting, “The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance“ on Wednesday. October 18, Salon B.
About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.