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Indium's Dr. Ning-Cheng Lee to Present at SiP Conferences China 2017
October 2, 2017 | Indium CorporationEstimated reading time: 1 minute

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will share his expertise on Interconnect Materials for SiP Packaging at the inaugural SiP Conferences China 2017 on October 19–20, in Shenzhen, China.
System-in-Package (SiP) technology is advancing quickly with components becoming smaller at each stage of development. To keep up with the ever-increasing demand for miniaturization, solder powder used to make SiP solder paste must become finer. In his presentation, Dr. Lee will explore if there is a limit to the solder powder size required for SiP applications, and how solder paste can support further SiP miniaturization.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.