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Alpha's Narahari Pujari to Present at 2017 Metallization and Interconnection Workshop
October 3, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions is participating in the upcoming Metallization and Interconnection Workshop taking place October 23–24 in Kostanz, Germany, where global experts will discuss status, trends and new product roadmaps for crystalline silicon (cSi) solar cells.
Narahari Pujari, R&D Manager for Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, will present a technical paper titled "Non-Eutectic Low Melting Temperature Alloys for Standard cSi Interconnection", which focuses on the expected changes in worldwide regulations that will require lead-bearing solders be replaced with less toxic alternatives.
"Lead-based solders have been used predominantly in PV applications due to their sufficiently low melting points and ability to make good, reliable solder joints between busbars and PV ribbon," says Pujari. "The critical components to consider for transitioning to lead-free solders are cost-efficiency and repeatable high performance, which are necessary to mirror the properties of lead-based solders currently in use."
Pujari's presentation will report on new non-eutectic alloys for tinning PV ribbon and cSi interconnection that were tested and benchmarked against standard tin-lead alloys for thermal and mechanical properties as well as functional performance.
2017 Metallization and Interconnection Workshop for cSi Solar Cells
Date: October 23–24, 2017
Venue: Konstanz, Germany
Presentation: Non-Eutectic Low Melting Temperature Alloys for Standard cSi Interconnection
Date: October 24, 2017
Time: 13:30 – 15:00
Presented by: Narahari Pujari, R&D Manager, Alpha Assembly Solutions
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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