Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Balver Zinn Group, LLE Soluciones and Repstronics to Exhibit at SMTA Mexico Expo & Tech Forum
October 6, 2017 | Balver Zinn GroupEstimated reading time: 2 minutes
The Balver Zinn Group, a leading global manufacturer of solder materials, will exhibit together with LLE Soluciones and Repstronics at the SMTA Mexico Expo & Tech Forum. The SMTA Mexico Expo is scheduled to take place October 18-19, 2017 at the hotel Riu Plaza in Guadalajara, Mexico.
Representatives from LLE, Repstronics and Balver Zinn will display on Booth #121-LLE and #19-28 a complete range of solder products, technologies and services.
Cobar OT2M is a rosin based solder paste classified as ROL0 according J-STD-004 and available in all common alloys. Cobar OT2M exhibits a long stencil life, excellent wetting performance and reduces voiding. The unique flux formulation produces clear and hardly visible residues and is available as a no-clean formulation for all applications such as high-end and automotive. The Cobar OT2M solder paste will be produced by LLE to ensure a committed supply to our valued customers in Mexico.
Brilliant B2012 solder wire is halide-free, rosin based and designed for manual and robotic soldering. B2012 is odorless and shows excellent solder and wetting performance. Brilliant B2012 is available in SN100C, SAC305 (SN97C) and Sn63 alloys with a standard flux content of 2,2 percent. Balver Zinn wires are available in diameters from 0.3 to 3.5mm.
The upcoming SMTA Expo is the Mexico platform to discover the unique and highly respected lead-free solder SN100C range. SN100C is a nickel-stabilized tin copper eutectic alloy, containing a small amount of Germanium to minimize oxidations. SN100C offers bright and shiny solder joints, comparable with lead-containing joints.
Also on display will be Cobar flux 390-RO-HT a high-end, No-Clean rosin based flux technology for wave and selective soldering applications. Cobar flux 390-RO-HT is a modified version of the high reliable 390-RX-HT flux and is classified ROL0 according to IPC standard J-STD-004.
390-RO-HT offers the highest reliability in humid environmental conditions and provides outstanding soldering results for use in high-tech and industrial applications.
About LLE Soluciones
Located in Guadalajara Mexico, LLE Soluciones Quimicas is a distributor of chemicals and materials and as exclusive distributor of Cobar Solder Products representing the entire portfolio of Balver Zinn-Cobar branded solder products including the highly respected range of Balver Zinn SN100C® products. For more information visit www.llesoluciones.mx.
About Repstronics
Located in Guadalajara Mexico, Repstronics is a representative sales company of equipment and consumables for the Mexico market and exclusive representative for Balver Zinn and Cobar brand products in Mexico. For more information visit http://www.repstronics.com/.
About the Balver Zinn Group
Headquartered in Germany, the Balver Zinn Group has facilities in Europe, the United States, and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste, adhesives and miscellaneous services and soldering products. For information about the company’s complete range of materials, visit www.balverzinn.com or www.cobar.com.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.