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Manz Showcases Redesigned Modular Assembly and Inspection Platform at Motek 2017
October 9, 2017 | Manz AGEstimated reading time: 2 minutes
Manz AG has fundamentally redesigned its LightAssembly modular assembly and inspection platform, which it will showcase at this week’s Motek 2017 trade fair happening in Stuttgart, Germany. The most important new functionalities are the increased spatial flexibility of assembly and process steps, thanks to the newly developed 3D lambda kinematics; standard carrier formats of up to 800 x 400 millimeters for processing larger workpieces; and expanded solutions for material feed and removal, which, along with 600x400 mm trays, also allow the use of blisters for small parts.
In doing so, the high-tech machine maker is responding to rising customer requirements, mainly in the electronics and automotive segments.
“The compatibility of the Manz LightAssembly with transfer systems from Bosch Rexroth was an especially important requirement for our customers in the automotive sector,” says Dr. Martin Freundt, Head of Machine Development at Manz. “That is why we designed our platform to be modular and scalable, meaning we can now meet customer requirements with our standard product. The individual modules for handling, screwing, laser welding and image processing are perfectly coordinated with each other on the LightAssembly platform and, when combined with our inline inspection systems, always ensure maximum quality with maximum throughput.”
For companies that wish to automate a work-intensive manual production process gradually, individual modules of the LightAssembly will now be available in a stand-alone version. These stand-alone systems can be easily integrated in existing non-automated production lines as an island-based or decoupled production solution. In addition to classical assembly processes such as bolting, a process module also controls newly integrated process steps such as laser welding or joining technologies like bonding, casting or pressing – in both the standard version of the individual system and in the integrated platform for interlinked production systems.
“Fully automated and integrated production lines have always been Manz’s strength. We are now transferring the expertise acquired there to more cost effective individual systems for customers who only want to automate sub-areas of an existing production system,” says Eckhard Hörner-Marass, CEO at Manz AG. “Both versions of the LightAssembly are examples of our new product philosophy: Manz stands for highly standardized and modular products that embody versatility, control a variety of process steps and can be used to flexibly automate production in many industries.”
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TLT Electronics Officially Opens Facility in Vietnam
05/06/2026 | TLT ElectronicsLithuanian EMS provider TLT Electronics has recently announced the opening of a new facility in Vietnam. For their clients, this is a chance to expand manufacturing into a second region without the headache of onboarding a new supplier. Same team, same processes, same quality standards — still TLT Manufacturing, just on another continent.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
The Missing Connection: Wire Harness Quoting Joins the Digital Age
05/01/2026 | Joanne Harris, Tech-2marketingWalk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?