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The Clean Truth: The Clean Truth About No-Clean Flux

10/14/2026 | Dr. Adam Klett -- Column: The Clean Truth
One of the most misunderstood terms in electronics manufacturing is “no-clean flux.” It sounds simple enough: Use the flux, complete the soldering process, and, best of all, you don’t have to clean. Unfortunately, that interpretation has led to decades of confusion and, in some cases, preventable reliability problems.

Rehm Thermal Systems Strengthens Its Presence in Spain and Portugal: Propelec Appointed as New Representative

10/14/2026 | Rehm Thermal Systems
Rehm Thermal Systems is expanding its sales activities in the Spanish and Portuguese markets and has appointed Propelec S.L. as its new representative for the Protecto and RDS UV LED product ranges.

Nordson Test & Inspection Wins 2026 Mexico Technology Award

10/14/2026 | Nordson Test & Inspection
Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, announced that its Nordson Sight™ Software Process Control Platform received a 2026 Mexico Technology Award in the Software Process Control category.

The Right Approach: Old Philosophies, New Tools

10/13/2026 | Steve Williams -- Column: The Right Approach
Quality management as a discipline was built by a handful of people who never touched a neural network, yet whose ideas map onto AI with almost eerie precision. Dr. Walter Shewhart, Dr. Edwards Deming, Dr. Joseph Juran, Philip Crosby, Dr. Kaoru Ishikawa, and Shigeo Shingo each built a philosophy around a specific lever for improving quality, including statistical rigor, reducing variation, prioritizing effort, eliminating defects, involving the workforce, and error-proofing the process itself.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.
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