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Indium Features Solder Paste for Fine Feature Printing at IWLPC 2017
October 11, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), October 24–26, in San Jose, California.
Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).
Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:
- Good response-to-pause
- A wide reflow profile window
- Outstanding slump resistance
- Excellent wetting capability
- Superior fine-pitch soldering ability
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.
For more information on Indium Corporation's materials for SiP or Indium3.2HF Solder Paste, click here or visit Indium Corporation's booth 39.
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