Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Zentech Secures United States Navy Blanket Order Agreement
October 17, 2017 | Zentech Manufacturing, Inc.Estimated reading time: 1 minute
Zentech–Fredericksburg Operations, formerly Colonial Assembly and Design, has received a United States Navy Blanket Order Agreement (BOA) for rapid technology integration of Special Mission Equipment (SME) on both manned and unmanned platforms in support of Maritime Patrol and Reconnaissance Aircraft (MPRA) and Persistent Maritime Unmanned Aircraft Systems (PMUAS).
The duration of the BOA is five years with a ceiling amount of $5,000,000.00 and covers all acquisition, technology and logistics lifecycle phases for the required analog, digital, RF and fiber optic electronics.
The issuing agency is Naval Surface Warfare Center (NSWC) – Crane Division as contract number N00164-18-G-JV01
Cynthia Snellings, VP Finance and Contracts at Zentech Fredericksburg, comments, "We are extremely pleased to receive this five-year contract award and for the opportunity to continue our legacy of high-performance at Naval Surface Warfare Center – Crane Division in support of our nation’s warfighters."
About Zentech
Zentech Manufacturing, Inc. is a privately held, engineering-driven contract manufacturer specializing in the design and manufacture of highly-complex electronic and RF circuit cards and assemblies. The company is headquartered in its purpose-built facility located in Baltimore, MD. Zentech-Fredericksburg Operations maintains several key certifications, including ISO 9001:2008, ITAR (US State Dept.) and IPC J-STD-001 certification. In addition, both Zentech locations are certified IPC Trusted Source suppliers for Class 3 mission-critical electronics. Zentech – Baltimore also is IPC J-STD-001 Space Addendum QML and AS9100 certified.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.