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Winners of Philippine Hand Soldering Competition 2026 Announced

10/28/2026 | Global Electronics Association
The Global Electronics Association held its Philippine Hand Soldering Competition during the 21st Philippine Semiconductor and Electronics Convention and Exhibition (PSECE), held from October 26–28, 2026, at the SMX Convention Center Manila in Pasay City.

Rehm Thermal Systems Introduces Vision RCC

10/28/2026 | Rehm Thermal Systems
Rehm Thermal Systems has launched the new Vision RCC, an innovative reflow soldering system specifically developed to meet the requirements of heavy and complex electronic assemblies.

Why Laser Soldering Gets So Much Attention

10/28/2026 | Nolan Johnson, SMT007 Magazine
Production soldering techniques that persist on the shop floor each have their own unique advantages. For complete board assemblies with standard joints and built-in volume, convection reflow is a perennial choice. For through-hole joints, the solution is wave soldering. A relatively small number of solder joints may justify robotic or human hand soldering, but another soldering technique that seems to be gaining prominence is laser soldering.

Indium Experts Investigate PCB Performance and Connectivity Solutions at SMTAI 2026

10/26/2026 | Indium Corporation
Five tech experts from Indium Corporation, a leading developer of AI-enabling and high-reliability soldering materials, will share new technical insights at SMTA International 2026, October 25–29, in Rosemont, Illinois.

Knocking Down the Bone Pile: Interposer Rework and Precision Solder Ball Attachment

10/28/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
An interposer is a thin substrate positioned between a semiconductor device, such as a BGA and PCBA, containing conductive features that allow electrical connections to be rerouted, recreated, or modified between the component and the PCB. Interposers may be manufactured from organic materials such as polyimide or FR-4, as well as silicon, glass, or other specialized materials. In PCB rework, they are most commonly used when the existing board design cannot easily be modified through conventional rework techniques.
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