-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Hand Soldering Competition Winner Crowned at IFTEC in Paris
October 19, 2017 | IPCEstimated reading time: 1 minute

IPC, in conjunction with IFTEC, conducted the IPC Hand Soldering Competition at IFTEC in Paris because the MIDEST exhibition, originally scheduled for October 2017 was moved to 2018. The competition was fierce as 33 competitors went soldering iron to soldering iron to take the hand soldering competition crown. Taking first place with a cash prize of €300 and a JBC Soldering Station was Catherine Cardinal-Simon from Thales Microelectronic in France, who earned 443 points out of a possible 446. Cardinal–Simon will now compete at the IPC World Championship Hand Soldering Competition located this year at productronica 2017 on 17 November.
Second place and a cash prize of €200 this year went to Mathieu Roudier from 3D Plus in France, who earned 438 out of a possible 446. Valerie Elliot Saudras from SELHA Group in France, took third place and a cash prize of €100. Participants in the hand soldering competition were tasked with building a functional electronics assembly, a new design this year, within a 60-minute time limit. Master Instructor Trainers from IFTEC served as independent judges and evaluated each assembly based on workmanship, overall functionality, compliance with IPC-A-610 Class 3 criteria and speed to complete the printed circuit board.
“The best-of-the-best hand soldering talent in France came to compete at IFTEC,” said David Bergman, IPC vice president of international relations. “The competition was tough, but each competitor rose to the challenge. We look forward to hosting more hand soldering competitions across the globe.”
Bergman added, “IPC would like to thank hand soldering competition gold sponsors: JBC, Kurtz Ersa, Thales and Weller; silver sponsors: Icape, MBO, Metronelec; bronze sponsor: CIF, IFTEC, JBC, MicroCare, SDEP, for their support.”
IPC is planning to hold additional hand soldering competitions in Europe, later this year in November as well as in 2018. Watch for announcements from IPC with locations and times. For more information on IPC events visit, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.