Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Kitron Signs Contract with Kongsberg Maritime
October 20, 2017 | KitronEstimated reading time: Less than a minute
Kitron has signed a frame agreement with Kongsberg Maritime with a potential value of NOK 200 million for the next five years. This expands the cooperation with Kongsberg.
Kitron will produce and deliver existing and future electronic modules and products to Kongsberg Maritime and actively collaborate on design, development, industrialization and production on future products and technology.
"This agreement is strategically important for Kitron. We have long-lasting and close relations with other divisions in KONGSBERG. This new partnership with Kongsberg Maritime, the largest business area within KONGSBERG, holds significant potential for us," said Hans Petter Thomassen, Managing Director of Kitron Norway.
Production will take place at multiple Kitron facilities.
"The sourcing and evaluation process has been thorough. A large number of potential suppliers have been evaluated on technical-, production- and sourcing capabilities. With a global presence and production footprint close to KONGSBERG markets, Kitron demonstrates the ability to be competitive," says Frode Kaland EVP Supply Chain, Kongsberg Maritime.
Share on:
Suggested Items
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
2024 Stromberg Student Leader Scholarship Recipient Announced
11/05/2024 | SMTASMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.
Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.