-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ECT Launches New Board Marker Probe for Reliable PCB Testing
October 24, 2017 | ECTEstimated reading time: 2 minutes
ECT adds the next generation board marker probe to its industry proven portfolio of ICT / FCT probes. The BMP-4 incorporates innovative and industry-leading features that result in superior performance, ease of use and maintainability.
ECT’s BMP-4 Board Marker Probe is designed for installation on bare board or loaded board test fixtures. It has been designed to combine ease-of-operation and maintainability with highest performance. The BMP-4 is easy to fixture and facilitates simple scribe tip replacement. The 10 mm diameter allows fine pitch probe placement. The BMP-4 is fully adjustable in z-direction. With more than 50,000 cycles before tip replacement and a durable motor, it is the ideal solution for high volumes.
When the tester is equipped with the appropriate electronics and software, the BMP-4 scribes a permanent circle on every “passed” PCB or device tested. Boards that fail the test are not marked. The risk of human error is eliminated in PCB testing and sorting.
When activated, the spring-loaded scribe tip contacts the PCB surface. The 12 V DC motor rotates the scribe in a counter clockwise direction and leaves a .050” (1.27 mm) circle mark onto the PCB. The probe requires less than .400” (10 mm) of fixture area when mounted into a threaded hole. It’s designed to mark board areas comprised of bare glass (FR4), solder mask over glass, copper, or bare tinned copper.
The probe features a full length threaded housing which allows for maximum adjustability in the Z-direction. Spare tip replacement assemblies are available.
Tony DeRosa, Senior Product Manager, comments: ”This board marker probe builds on our extensive experience in providing solutions for in-circuit and functional test as well as our operational knowhow to integrate electro-mechanical assemblies. The BMP-4 adds to ECT’s industry proven board marker probe BMP-1 series.”
ECT BMP-4 board marker probes meet the need for cost efficient and highly reliable in-circuit and functional test solutions.
About Everett Charles Technologies (ECT)
ECT (headquartered in Fontana, CA) is the world's leading manufacturer of POGO contact probes for a wide range of applications including industrial, medical, military, connectors and testing bare and loaded printed circuit boards. We invest in R&D programs which address engineering and materials issues that will impact contact solutions for the next decade. Methods for maintaining electrical continuity in miniature probes, improved spring technologies and probe head geometries are under continual review. ECT POGO contacts are marketed worldwide through sales offices in the United States, Europe and Asia. ECT is a company of Xcerra Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.