Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
Dr. Jennie Hwang to Discuss Solder Joint Voids at SMTA Webtorial Sessions
October 26, 2017 | SMTAEstimated reading time: 1 minute
Industry expert Dr. Jennie Hwang, CEO of H-Technologies Group, will talk about solder joint voids at two 90-minute SMTA Webtorial sessions on November 1 and 2, from 1:00pm to 2:30pm ET.
This webtorial provides a holistic overview on solder joint voids. Four fronts in the industry have rekindled the interest and/or concerns about solder joint voids – the lead-free solder joints; the increased use of advanced packages (BTCs, PoPs); the ever-miniaturized electronics comprising “delicate” solder joints; and the increased demand in solder joint reliability for high performance and high reliability products. Different sources of solder joint voids, and their respective causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance, and the steps to minimize solder joint voids of both the array solder ball solder joints (e.g., PoP, BGA, CSP) and lead-frame solder joints (e.g., QFP, BTC) will also be outlined. The webtorial will conclude with the source of voids that is most critical to reliability, thus to avoid.
The webtorial provides the working knowledge to all who are concerned about the reliability or interested in understanding the solder joint properties in relation to voids including designers, engineers, researchers, managers and business decision makers.
Registrations are being taken through the SMTA Online Registration System. To register, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium Promotes Huang to Senior Manager, Marketing Communications
08/28/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing Communications, to continue to lead the company’s branding and promotional efforts.
Rehm Academy Expands Its Training Program
08/28/2025 | Rehm Thermal SystemsThe demands on modern industrial companies and employees continue to rise, and therefore, the topic of further education is becoming increasingly important today.
MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider
08/28/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
ZESTRON Expands Capabilities with Addition of the EPS by i-Tech AG 75 Pallet Cleaning System
08/26/2025 | ZESTRONZESTRON, the global leader in high-precision cleaning solutions and services, is excited to announce the addition of a new capability in its Technical Center in Manassas, VA: