The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
KIC to Exhibit at SMTA Silicon Valley Expo
November 2, 2017 | KICEstimated reading time: 1 minute
KIC will exhibit at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place November 29, 2017 at Bestronics Inc. in San Jose, California. MB (Marybeth) Allen will showcase how to turn your reflow ovens into a smart ovens with KIC's ecosystem comprised of a smart profiler, automatic profiling system and the all-new KIC Vantage network insight software.
The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, the new smart profiler also suggests an improved reflow oven setup. The thermal profiler features a small compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection and faster cool-down between profiles.
The KIC Vantage network intelligence system automatically acquires and delivers insightful information from all the ovens in the factory in real-time to allow factories to produce consistent quality at lower costs. The software is retrofitable and can connect to the factory MES system.
About KIC
Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.
KIC products include the KIC SPS, K2, X5, KICstart2, ProBot, 24/7 Wave and the KIC RPI. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.
For more information about KIC, click here.
Share on:
Suggested Items
Solar Powered Aircraft Achieves New Stratospheric Success
12/26/2024 | BAE SystemsA British-led team of engineers has taken a leap forward in the race to harness the stratosphere for earth observation and communications, completing a new series of test flights of BAE Systems’ High Altitude Pseudo Satellite (HAPS) Uncrewed Aerial System (UAS), PHASA-35®, in quick succession.
Modernizing TAURUS for the Bundeswehr
12/25/2024 | MBDAThe Bundeswehr and TAURUS Systems GmbH (a joint venture between MBDA and SAAB) have signed a contract for the maintenance and modernization of the TAURUS stand-off weapon system. The measures will ensure the weapon's operational readiness until at least 2045.
SIA Statement on Biden Administration’s Launch of Section 301 Trade Investigation Related to China’s Targeting of the Semiconductor Industry for Dominance
12/25/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden administration’s decision to launch a Section 301 trade investigation focused on China’s acts, policies, and practices related to targeting of the semiconductor industry for dominance.
Two Additional Boeing O3b mPOWER Satellites Successfully Communicating in Space
12/23/2024 | BoeingTwo more Boeing-built O3b mPOWER satellites are sending and receiving signals in space after launching from the Kennedy Space Center, Florida at 5:26 p.m.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.