-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Balver Zinn Group to Sponsor IPC Hand Soldering Competition at productronica
November 3, 2017 | Balver Zinn GroupEstimated reading time: 1 minute
The Balver Zinn Group will be sponsoring the IPC Hand Soldering Competition (IPC-HSC) scheduled to take place November 14-16, 2017 at productronica in Munich, Germany. Balver Zinn will be providing BRILLIANT B2012 SAC305 (SN97C) solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
B2012 is odorless and shows excellent soldering and wetting performance. The no-clean, halide free solder wire flux technology was developed for rework and touch-up. B2012 is available in SN100C, SAC305 (SN97C), Sn63 alloys with a standard flux content of 2.2%. Balver Zinn wires are available in diameters from 0.3 to 3.5mm.
During the IPC-HSC, industry professionals will demonstrate their soldering skills. Hand soldering of high density printed circuit boards demands highly skilled operators to ensure a zero-defect soldering process, and this competition will recognize the best skills in hand soldering complex printed circuit board assemblies. Over a three day period, participants will compete against each other to build a functional electronics assembly within a 60-minute time limit.
Assemblies will be judged on solder results in accordance with IPC-A-610F Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructors from IPC licensed master training centers will serve as the judges during the competition.
If you don’t want to compete, but want to show your support for the participants, stop by IPC Booth #307 in Hall A1.
Balver Zinn, Germany is an authorized IPC Distributor with an IPC licensed training center.
Visit us in Booth #261, Hall A4 for more information or click here.
About the Balver Zinn Group
Headquartered in Germany, the Balver Zinn Group has facilities in the United States, Europe and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste and miscellaneous service and soldering products. For more information about the company’s complete range of solder materials, visit www.balverzinn.com or www.cobar.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.