-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson to Exhibit New Solutions for Electronics Manufacturing at productronica 2017
November 7, 2017 | NordsonEstimated reading time: 3 minutes
Nordson Corporation announces that eight divisions from its Advanced Technology segment will be exhibiting together at productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany during November 14-17, 2017, in Hall A2, Stands 245, 345, and 445.
These Nordson divisions are highly successful in designing, manufacturing, and delivering systems to customers in the electronics industry globally. The equipment is used for applications that range from printed circuit board assembly to semiconductor packaging. Visit each company's webpage to find out more about what each will be exhibiting.
Nordson ASYMTEK – Precise Automated Fluid Dispensing & Coating
Two new dispensing platforms, the Helios bulk & two-component dispensing system, and the Vantage dispensing and jetting system will be introduced. New conformal coating line solutions will demonstrate top and bottom inspection, a thickness sensor, a two-component (2k) coating feeding system, a new spray valve, and a new LED curing oven.
Nordson DAGE – X-Ray Inspection and Bondtesting
The new Nordson DAGE 4800 Advanced Automated Wafer Testing bondtester is at the forefront of wafer testing technology, catering to the testing of wafers from 200mm up to 450mm. Also featured will be the 4000Plus Bondtester with Camera Assist Automation configured for battery testing. The Quadra 7 X-ray inspection system, with 6.7 MP ultra-high quality images displayed at full one-to-one resolution, plus the Quadra 5, which offers high performance and ease of use for 2D and 3D X-ray applications will also be part of the demonstrations.
Nordson DIMA – Hot Bar Bonding and Soldering
Nordson DIMA introduces an automated inline concept for Heat Seal Bonding, C-Quence, which includes unique modules for ACF laminating, product alignment, final bonding, and more. Also on display will be DIMA's popular desktop models and stand-alone systems for hot bar bonding and soldering.
Nordson EFD – Precision fluid dispensing & components, solder paste & thermal interface materials
Nordson EFD introduces a new line of high-performing non-silicone thermal compound formulations suitable for a wide range of electronic and electromechanical applications. Also on display will be EFD's specialized solder paste formulations, automated dispensing robots, PICO Pµlse and Liquidyn P-Jet CT jet valves, and the micro-dispensing xQR41 MicroDot needle valve. Precision fluid dispensers and Optimum dispensing components will also be featured.
Nordson MARCH – Plasma Treatment
As semiconductor device manufacturers further shrink the size and increase the reliability of packaged devices, plasma treatment is used during wafer-level packaging and other advanced applications. Nordson MARCH treatment systems are capable of handling multiple wafer sizes and high-throughput, automated processing.
Nordson MATRIX – Automated X-Ray Inspection
The new XS-series – a new small-footprint high-resolution automated X-ray inspection system concept designed for high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays.
Nordson SELECT – High-Speed Selective Soldering
The new Integra 508.5 five-station selective soldering system designed for high-volume, high-performance soldering will be introduced.
Nordson YESTECH – Automated Optical Inspection
The new Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices and offers complete inspection coverage with unsurpassed 2D and 3D defect detection.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing of adhesives, coatings, sealants, biomaterials, polymers, plastics and other materials, fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 35 countries.
For more information, please visit the Nordson website.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.