-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Nordson to Exhibit New Solutions for Electronics Manufacturing at productronica 2017
November 7, 2017 | NordsonEstimated reading time: 3 minutes
Nordson Corporation announces that eight divisions from its Advanced Technology segment will be exhibiting together at productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany during November 14-17, 2017, in Hall A2, Stands 245, 345, and 445.
These Nordson divisions are highly successful in designing, manufacturing, and delivering systems to customers in the electronics industry globally. The equipment is used for applications that range from printed circuit board assembly to semiconductor packaging. Visit each company's webpage to find out more about what each will be exhibiting.
Nordson ASYMTEK – Precise Automated Fluid Dispensing & Coating
Two new dispensing platforms, the Helios bulk & two-component dispensing system, and the Vantage dispensing and jetting system will be introduced. New conformal coating line solutions will demonstrate top and bottom inspection, a thickness sensor, a two-component (2k) coating feeding system, a new spray valve, and a new LED curing oven.
Nordson DAGE – X-Ray Inspection and Bondtesting
The new Nordson DAGE 4800 Advanced Automated Wafer Testing bondtester is at the forefront of wafer testing technology, catering to the testing of wafers from 200mm up to 450mm. Also featured will be the 4000Plus Bondtester with Camera Assist Automation configured for battery testing. The Quadra 7 X-ray inspection system, with 6.7 MP ultra-high quality images displayed at full one-to-one resolution, plus the Quadra 5, which offers high performance and ease of use for 2D and 3D X-ray applications will also be part of the demonstrations.
Nordson DIMA – Hot Bar Bonding and Soldering
Nordson DIMA introduces an automated inline concept for Heat Seal Bonding, C-Quence, which includes unique modules for ACF laminating, product alignment, final bonding, and more. Also on display will be DIMA's popular desktop models and stand-alone systems for hot bar bonding and soldering.
Nordson EFD – Precision fluid dispensing & components, solder paste & thermal interface materials
Nordson EFD introduces a new line of high-performing non-silicone thermal compound formulations suitable for a wide range of electronic and electromechanical applications. Also on display will be EFD's specialized solder paste formulations, automated dispensing robots, PICO Pµlse and Liquidyn P-Jet CT jet valves, and the micro-dispensing xQR41 MicroDot needle valve. Precision fluid dispensers and Optimum dispensing components will also be featured.
Nordson MARCH – Plasma Treatment
As semiconductor device manufacturers further shrink the size and increase the reliability of packaged devices, plasma treatment is used during wafer-level packaging and other advanced applications. Nordson MARCH treatment systems are capable of handling multiple wafer sizes and high-throughput, automated processing.
Nordson MATRIX – Automated X-Ray Inspection
The new XS-series – a new small-footprint high-resolution automated X-ray inspection system concept designed for high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays.
Nordson SELECT – High-Speed Selective Soldering
The new Integra 508.5 five-station selective soldering system designed for high-volume, high-performance soldering will be introduced.
Nordson YESTECH – Automated Optical Inspection
The new Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices and offers complete inspection coverage with unsurpassed 2D and 3D defect detection.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing of adhesives, coatings, sealants, biomaterials, polymers, plastics and other materials, fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 35 countries.
For more information, please visit the Nordson website.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.