Indium Features Next-Generation Materials for Semiconductor Assembly at IMAPS

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Indium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.

The company will showcase the following among its featured products:

InBAKE™29 Cu sinter paste is developed for high-power die-attach applications and for applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperature. InBAKE™29 can be sintered either pressureless or with pressure, under low oxygen atmospheres of O2 <500ppm. After 4,500 TCT cycles (-40°C–175°C), the die shear strength increases compared to time zero. Target applications include high-power die-attach (SiC MOSFET and Si IGBT), RF die-attach, and power LED die-attach.

SiPaste® C312HF is a cleanable solder paste formulated for fine-aperture printing applications. This material exhibits optimum transfer efficiency with consistent printing stability after continuous use, a long stencil life of at least four hours without dry-out, and a benign, non-corrosive residue that can remain post-reflow without cleaning or be easily cleaned with semi-aqueous or saponifier technology.

InFORCE® pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, meaning less paste can be used. The portfolio includes:

InFORCE®29 – a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.

InFORCE®MF – a proven pressure Ag sinter paste designed for SiC die-attach applications. InFORCE®MF is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.

Solder TIMs deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, they enhance battery life, reduce cooling fan size, and minimize heat-sink mass, all while maintaining RoHS compliance and supporting step soldering requirements.

Durafuse® HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.

Durafuse® LT is a solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.

Indium Corporation’s Formic Acid Soldering Technology (FAST) product offerings, including preforms, InFORMS®, and novel solder pastes, enable high-reliability, flux-free soldering, ideal for efficient manufacturing of next-generation power electronics.

The company will also feature its tin and tin-based alloys and compounds and cold-welding solutions.

To learn more about Indium Corporation’s innovative products, visit our experts at booth 321 during the IMAPS symposium.