Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
EIPC SpeedNews: News from the European PCB Industry
November 7, 2017 | EIPCEstimated reading time: Less than a minute
- 50 Years of Service, a Century of Conferences, a Lifetime of Excellence
- Positive Operative Business Performance Continues at Schweizer
- Zollner invests in the first combined pick-and-place and dispensing unit from Essemtec
- iMaps UK Conference
- Microtech 2018
- Advanced Packaging Conference, November 14-15, 2017 in Munich
- ICT Evening Seminar, December 5, 2017
- BGA, QFN Fine Pitch Rework Experience Live, November 21, 2017
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
BEST Inc. Provides High-Reliability BGA Reballing and Component Rework Services
08/22/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce its component rework services are available for all types of area array devices including ball grid array, land grid array and quad flat no-lead SMT packages.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in