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EIPC SpeedNews: News from the European PCB Industry
November 7, 2017 | EIPCEstimated reading time: Less than a minute

- 50 Years of Service, a Century of Conferences, a Lifetime of Excellence
- Positive Operative Business Performance Continues at Schweizer
- Zollner invests in the first combined pick-and-place and dispensing unit from Essemtec
- iMaps UK Conference
- Microtech 2018
- Advanced Packaging Conference, November 14-15, 2017 in Munich
- ICT Evening Seminar, December 5, 2017
- BGA, QFN Fine Pitch Rework Experience Live, November 21, 2017
Suggested Items
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
APE, Automated Production Equipment, Marks 56-year Milestone
05/12/2025 | APEAutomated Production Equipment, or A.P.E. as the company has been known for more than a half century, is marking more than 50 years as a leading U.S. equipment supplier serving the printed circuit board assembly (PCBA) industry.
Real Time with... IPC APEX EXPO 2025: Technica's Innovations and Partnerships
04/11/2025 | Real Time with...IPC APEX EXPOJason Perry of Technica USA and Robert Beber of Reeco share about the engagement at their extra-large booth at this year's show, where they showcased 11 pieces of equipment and announced the new partnership for Technica with Reeco, supplier of ESD clothing and workbenches. With a positive industry outlook despite global trade uncertainties, Technica has plans to expand in North America.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics
02/06/2025 | MacDermid Alpha Electronics SolutionsIn an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026.
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