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Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 

BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper

04/15/2026 | BEST Inc.
BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.

OKI Launches EMS for AI Server Equipment Featuring Proprietary High Heat Dissipation Technology

04/07/2026 | BUSINESS WIRE
OKI will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026.

2026 IPC Masters Competition China Wraps Up With Record Participation

04/07/2026 | Blair Yan, Global Electronics Association East Asia
The three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.

IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing

04/01/2026 | Global Electronics Association
On March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
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