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Advanced Electronics Packaging Digest

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GlobalFoundries, Qualinx Demonstrate First European Sovereign Chip Manufacturing Flow

06/10/2026 | BUSINESS WIRE
GlobalFoundries (GF) and Qualinx announced the successful completion of the first fully European-based, end-to-end semiconductor manufacturing flow at GlobalFoundries’ Dresden fab on its FDX technology.

Green Circuits Expands Global Footprint with Addition of Canada-Based Manufacturing Operation

06/10/2026 | Green Circuits
Green Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and life sciences, industrial electronics, and semiconductor and AI hardware markets, announced the expansion of its organization with the addition of a Canada-based operation that will operate under the Green Circuits brand.

Wistron Adopts NVIDIA Omniverse DSX to Accelerate Digital Factory Operations

06/10/2026 | Wistron
Wistron is actively implementing the NVIDIA Omniverse DSX Blueprint and Physical AI technology to drive the upgrade of AI factory smart manufacturing and a leap in operational efficiency.

W&S Enters New Growth Phase Through Strategic Partnership and New Leadership

06/09/2026 | W&S
W&S, an established distributor and service partner of capital equipment, automation solutions and lifecycle services for the electronics manufacturing industry in the Benelux, has announced a new strategic partnership and strengthened shareholder structure to support the next phase of its growth.

SCHMID Group Announces Agreement for New China Manufacturing Campus to Support Future Growth

06/09/2026 | SCHMID Group
SCHMID Group N.V., a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, announced that it has signed a preliminary manufacturing project letter of intent and investment framework agreement with local authorities in Banfu Industrial Zone, Zhongshan, Guangdong Province, China, regarding the establishment of a new manufacturing campus.
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