-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Awards IPC-4101 Qualified Products Listing to Ventec International Group
November 13, 2017 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group is delighted to announce an IPC-4101 Qualified Products Listing (QPL). The IPC's validation services program has qualified VT-90H and VT-901 to specification sheet 41 of IPC-4101E, specification for base materials for rigid and multilayer printed boards. An intensive two-day audit was also completed where the manufacturing practices, test methods and conformance requirements of IPC-4101 were reviewed.
VT-90H (UL-94 HB) and VT-901 (UL-94 V0) are exceptional material solutions for high reliability ML rigid and flex rigid PCBs for use in thermally challenging environments, with high Td (VT-901=395, VT-90H=408), a Tg of 250oC and Low-Axis CTE (50). Both polyimide materials provide the extremely high reliability performance particularly demanded by military and aerospace as well as downhole drilling and similarly challenging applications.
Ventec manufactures, fabricates and distributes all VT-90H and VT-901 polyimide from AS9100 accredited facilities, using specially designed treaters with multiple stage filtration systems and 100% Automated Optical Inspection (AOI) for prepreg FOD-control. The same specialist equipment is used for the production of thin-core laminates for use in the most demanding space and aerospace PCB applications.
Mark Goodwin, COO USA & EMEA of Ventec International Group commented: "Applying for an IPC Qualified Product Listing (QPL) for our polyimide laminate and prepreg provides an independent endorsement of the quality of our production controls and materials for use in high reliability mil/aero applications. The IPC QPL is a trusted reference list for the entire electronics supply chain. As a world leader in the production of high performance laminates and prepregs, we are delighted to be the first copper clad laminate manufacturer to have a polyimide material added to the IPC QPL following a rigorous facility audit, as well as meeting the requirements of the qualification testing program at an independent test laboratory."
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products, and identifies processes which conform to IPC standards.
"Ventec has differentiated itself from the competition by becoming part of IPC's global network of trusted industry sources," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Ventec as the first member of trusted QPL suppliers to meet IPC 4101 from the country of China."
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,600 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Suggested Items
Incap Estonia Recognized with Second Golden Label for Responsible Business
06/27/2025 | IncapIncap Electronics Estonia has been awarded a golden label by the Responsible Business Forum in Estonia for the second time. The responsible business label is a prestigious symbol in Estonia that identifies entrepreneurs and organisations that demonstrate excellence in environmental, social, and economic responsibility.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
TT Electronics Achieves ISO 13485 Medical Certification at Mexicali EMS Facility
06/27/2025 | TT ElectronicsThis milestone underscores TT Electronics’ commitment to delivering high-quality, compliant, and reliable manufacturing solutions to its global customers in healthcare and life sciences.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Scanfil Strengthens its Customer Portfolio in Medtech & Life Science by Signing Agreement with Liquid Instruments
06/27/2025 | BUSINESS WIREScanfil and Liquid Instruments have signed a manufacturing outsourcing agreement for Scanfil’s Melbourne plant in Australia. This agreement supports Liquid Instruments’ strategy to onshore production of its flagship Moku platform, strengthening domestic supply chains and bringing manufacturing closer to its research and development hub.