Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Alpha to Present on Lead-Free Soldering to the cSi Cell Stringing Process at Intersolar India
November 13, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions is participating in the upcoming Intersolar India taking place December 5-7 in Mumbai, India, where global experts focus on photovoltaics, PV production technologies, energy storage systems and solar thermal technologies.
Narahari Pujari, R&D Manager for Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, will present a technical paper on Lead-Free Soldering to the cSi Cell Stringing Process that focuses on PV market, current trends in the development of lead-free solutions and the impact on manufacturing costs by transitioning away from lead-based solder alloys, which are currently in use predominantly due to their sufficiently low melting points and ability to make reliable solder joints.
"Lead-containing alloys are not only toxic, but can result in hazardous waste classification for PV modules at the end of shelf-life, thus increasing costs overall when safe disposal efforts are included," said Pujari. "In order for the market to embrace the adaptation of lead-free alloys, we must first discuss the market drivers and understand the technological and manufacturing challenges involved with such a migration."
Various available technologies are critically assessed in Pujari's technical presentation which finds that although there is currently no data on long-term reliability of PV modules using lead-free alloys, there is sufficient evidence that supports its likelihood. Additionally, lead-free solders for PV ribbon are proving to be cost and energy-efficient.
2017 Intersolar India
Date: Tuesday 5th December, 2017 – Thursday 7th December 2017
Venue: Mumbai, India
Presentation: Lead-Free Soldering to the cSi Cell Stringing Process
Date: 6th December 2017
Time: 10:55 am
Presented by: Narahari Pujari, R&D Manager, Alpha Assembly Solutions
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.