Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
CyberOptics Integrates Advanced MRS Technology into New SE3000 3D Solder Paste Inspection System
November 14, 2017 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics will demonstrate the new SE3000 3D Solder Paste Inspection (SPI) system with a proprietary Multiple-Reflection Suppression (MRS) Sensor in Hall A2, Stand 439 at productronica 2017, taking place November 14-17, 2017 at the Messe München, in Germany.
SE3000The new SE3000 3D SPI system is the very first SPI system to incorporate the industry-leading MRS sensor technology, with a finer resolution for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits. The unique sensor architecture simultaneously captures and transmits multiple images in parallel, while highly sophisticated 3D fusing algorithms merge the images together, delivering microscopic image quality at production speed. Combined with the award-winning, easy-to-use software, solder paste inspection has reached a new level of precision for the most stringent requirements.
“Smaller and mobile is a key trend driving the demand for an even higher level of accuracy and resolution,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, “We’ve optimized our proprietary MRS sensor technology that is widely used for Automated Optical Inspection applications world-wide, and integrated it into our new SE3000 SPI system to address these critical customer requirements better than any alternate solution.”
For maximum flexibility, the new SE3000-DD 3D AOI dual lane, dual sensor system caters to varying widths. This unique design provides the ability to inspect high volumes, the convenience of inspecting different board sizes simultaneously on different lanes, or even switching from dual lane to single lane mode to inspect very large boards.
At productronica Germany, CyberOptics will also unveil the new SQ3000 3D CMM system and the new SQ3000-DD™ 3D AOI system, both powered by MRS technology.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.