The Knowledge Base: The Era of Advanced Packaging
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Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
I-Connect007 Launches The Printed Circuit Designer’s Guide to… Power Integrity by Example Micro eBook
November 15, 2017 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is excited to announce the release of the latest title in our micro eBook series: The Printed Designer's Guide to... Power Integrity by Example.
The Printed Circuit Designer’s Guide to… is an ongoing series of micro eBooks specifically dedicated to the education of PCB designers. This book series has become the gold standard for people seeking the most relevant design information available.
The Printed Circuit Designer’s Guide to… Power Integrity by Example is authored by Fadi Deek of Mentor, A Siemens Business. This title is a follow-up to Deek’s previous book on signal integrity, which is also available for download in our library.
This new book on power integrity provides a thorough investigation of power distribution network performance. Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter.
“An important message from this book is to know your parallel resonances because that will be where most of your noise comes from. You can also use the principles laid out in this book to help you avoid catastrophe in your next design,” says Dr. Eric Bogatin, dean of the Teledyne LeCroy Signal Integrity Academy.
Readers will better understand cause-effect relationships between varying factors, and how to consider these when making design decisions.
Download this free book today at I-007eBooks/PIE!
Here are some other exciting titles in The Printed Circuit Designer’s Guide to... eBook series:
- Design for Manufacturing (DFM) by Altium
- Flex and Rigid-Flex Fundamentals by American Standard Circuits
- Secrets of High-Speed PCBs – Parts 1 & 2 by Polar Instruments
...and these upcoming releases:
- Executing Complex PCBs by Freedom CAD
- Documentation by DownStream Technologies
- Thermal Management with Insulated Metal Substrates by Ventec International Group
We hope you enjoy The Printed Circuit Designer’s Guide to… Power Integrity by Example.
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