-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Multitest InWaferX for Final Test of Singulated WLCSPs
November 21, 2017 | MultitestEstimated reading time: 1 minute

Multitest’s new InWaferX final test solution for singulated WLCSPs addresses the increased quality demand for automotive applications as these quality requirements are expanding to cost sensitive, high volume consumer applications. Based on the production proven InCarrier technology, InWaferX ensures highest efficiency and yield for lowest cost of test.
The InWaferX solution enables post saw testing of singulated WLCSPs detecting all production defects in true final test of singulated devices. In addition, the same process can be deployed for retest and RMA process handling. Both options significantly enhance the production quality of the shipped devices and substantially support the zero-defect parts per million (ppm) efforts of the device makers. In addition the InWaferX is equipped with a full 6 side vision inspection capability for complete physical validation.
InWaferX combines high multisite testing with the highest positioning accuracy for best yield and 100% touch efficiency on the rectangular carrier trays. InWaferX supports the high daily output requirements in today’s high-volume manufacturing (HVM) environments.
Based on the well-established InCarrier / InStrip solution, the InWaferX supports full range temperature testing, as well as, MEMS/sensor testing. The InWaferX final test solution can be applied for WLCSPs from sawn film frame or tape and reel.
Andreas Bursian, Senior Director Innovation, comments: “We did extensive system validation on a production test floor and passed all requirements such as ESD, safety and operational conditions. Compared to the traditional wafer probing, the InWaferX test solution has proven to increase test throughput and outgoing device quality.
About Multitest
Multitest (headquartered in Rosenheim, Germany) is one of the world’s leading manufacturers of semiconductor material handling equipment and interfaces for the testing and calibration of semiconductors and sensors. Multitest markets a broad portfolio of innovative and performance driven test handlers, contactors and ATE printed circuit boards. Multitest has more than 30 years of experience in the semiconductor industry, providing solutions to the automotive, consumer, communication, and sensor markets. Multitest is a company of Xcerra™ Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources. Additional information can be found at www.multitest.com and www.Xcerra.com
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.
Smart Eye Receives Milestone AIS Order from Fleet Safety Company Optix
09/11/2025 | Smart EyeSmart Eye, a global leader in Human Insight AI and Driver Monitoring Systems (DMS), announced a milestone order for its AIS system from Optix, a global provider of fleet management solutions. Initially, in 2025, 4,000 commercial vehicles will be equipped with Smart Eye’s technology, marking the first wave of deployments globally.
Datest Unveils Viscom iX7059 XL 3D CT AXI System
08/25/2025 | DatestDatest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, and the go-to destination for when your boards misbehave and your AXI line goes on vacation, is thrilled to announce the arrival of its newest diagnostic weapon: the Viscom iX7059 XL 3D CT AXI Inspection System.
Gardien Services Installs Customized G93 Flying Probe Tester – Largest Test Area in North America/Europe
09/07/2025 | Gardien GroupGardien Group is proud to announce the successful installation of a customized G93 Flying Probe Test Machine at a major manufacturer in North America. This cutting-edge system features the largest test area of any flying probe tester in North America and Europe, setting a new benchmark for PCB testing capabilities.
Meet with The Test Connection Inc. (TTCI) at SMTA Guadalajara 2025
08/18/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce its participation at the upcoming SMTA Guadalajara Expo & Tech Forum, taking place September 17–18, 2025, at Expo Guadalajara, Salón Jalisco Hall D & E.