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GEN3 Systems to Showcase Advanced Reliability Test Solutions at productronica 2025 in Munich
October 29, 2025 | Gen3 SystemsEstimated reading time: 1 minute
GEN3 a leader in innovative reliability test solutions, is excited to announce its participation at productronica 2025, the world’s premier trade fair for electronics development and production. The event will be held in Munich, Germany at the Trade Fair Center Messe München, from 18–21 November 2025. GEN3 will be located in Hall A2, Stand 511.
Joining the team at the booth will be Bob Neves, creator of the HATS²™ – Highly Accelerated Thermal Shock Tester, bringing his expertise directly to attendees. Visitors will have the opportunity to explore GEN3’s cutting edge reliability test equipment, including:
- HATS²™ (Highly Accelerated Thermal Shock Tester) – This system is designed to simulate convection reflow assembly and assess robustness of PCB and substrate via structures, offering rapid temperature cycling between –65 °C and +265 °C. It supports real time resistance monitoring and can achieve up to 1 000 thermal shock cycles per week, compressing test times by 60 – 80% compared to traditional methods. It is compatible with IPC TM 650 Methods 2.6.7.2C (air to air thermal shock) and 2.6.27B (convection reflow simulation.
- NEWLY Launched AutoCHT (Condensation Humidity Tester) – The world’s first platen based system that generates a controlled condensation layer on test boards during Damp Heat testing. It allows the test board temperature to be adjusted independently of the chamber environment, with precision to 0.1 °C, and at least 1 °C below the dew point. The AutoCHT is fully integrated with the AutoSIR2+ system, enabling real time monitoring of moisture effects on board designs, spacings and coatings—ideal for characterising conformal coating defects, electrochemical migration and other moisture driven failure mechanisms.
- AutoSIR2+ –Award winning Surface Insulation Resistance Tester.
- CM Series – Ionic Contamination Tester with dual capability for both PICT & ROSE Testing.
This showcase underscores GEN3’s commitment to delivering advanced solutions for accelerated reliability testing, enabling engineers and manufacturers to ensure product quality and long term performance across industries such as aerospace, defence, medical and electronics manufacturing.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Real Time with... productronica 2025: Enhancing Manufacturing With Conformal Coatings From MacDermid Alpha
12/04/2025 | Real Time with...productronicaSaskia Hogan, global product manager for conformal coatings at MacDermid Alpha Electronics Solutions, discusses the role of coatings in improving manufacturing efficiency and sustainability. She addresses challenges faced by customers, such as harsher environments and cost pressures, while emphasizing the need for high reliability in critical applications.
GÖPEL electronic Integrates Boundary Scan into Takaya Flying Prober
12/01/2025 | GÖPEL electronicFully automated multi-panel programming of test subjects for fast and flexible handling in the manufacturing process
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
11/26/2025 | Nash Bell -- Column: Knocking Down the Bone PileSolderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.
TTCI Receives 2025 Global Technology Award for Redefining Design for Testability in High-Reliability Electronics
11/20/2025 | TTCIThe Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, has been awarded the 2025 Global Technology Award in the Test Services category for its groundbreaking work in Design for Testability (DFT).
SPEA Honored with Bosch Global Supplier Award
11/14/2025 | SPEABosch, a leading global supplier of technology and services, has honored SPEA with a prestigious Bosch Global Supplier Award, recognizing the company’s excellence as a provider of manufacturing test equipment and systems for microelectronics