Nolan’s Notes: Looking Deep Into the Future With X-ray
Knocking Down the Bone Pile: Basics of Component Lead Tinning
Standard of Excellence: Anticipating Customer Needs Early and Often
SMTA Announces Call for Abstracts for 2018 Events
November 22, 2017 | SMTAEstimated reading time: 1 minute
SMTA announced that abstracts are now accepted for several events taking place in 2018. All submissions must be strictly technical with focus on technology research and minimize marketing content. The following events are all currently soliciting abstracts:
Medical Electronics SymposiumAbstracts Deadline: December 1, 2017
Electronics in Harsh Environments ConferenceAbstracts Deadline: December 1, 2017
South East Asia Technical Training Conference on Electronics Assembly TechnologiesAbstracts Deadline: January 15, 2018
International Conference on Electronics Enabling Technologies (ICEET)
Abstract Deadline: January 19, 2018
eSmart Factory conferenceAbstracts Deadline: January 2018
SMTA International ConferenceAbstract Deadline: February 16, 2018
SMTA/CALCE Symposium on Counterfeit Parts and MaterialsAbstract Deadline: March 20, 2018
International Wafer-Level Packaging Conference Abstract Deadline: April 10, 2018
On-line Presentations (Webinars & Webtorials)
Now scheduling for 2018 - Contact Jenny Ng, jenny@smta.org
Journal of SMT
Now accepting papers for 2018 publication - Contact Ryan Flaherty, ryan@smta.org
Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a technical paper for the proceedings.
View details online. Please contact Jenny Ng, jenny@smta.org or 952-920-7682, with questions.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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