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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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ICT Announces Presenter Lineup for Evening Seminar
November 24, 2017 | Institute of Circuit TechnologyEstimated reading time: Less than a minute
The Institute of Circuit Technology (ICT) Evening Seminar, which will be held December 5, 2018 at the Majestic Hotel in Harrogate, UK, will feature Emma Hudson of UL, Andy Cobley of Coventry University, and Jean-Paul Birraux of First EIE (Geneva) as presenters.
Hudson will present on the topic of solder limits for recognized PCBs and materials. Cobley, meanwhile, will present on a new project, Selective Metallization of Dielectric Substrates Using a Magnetic Field.
Birraux, on the other hand, will give a presentation titled “Developments in Photo-plotters, UV Direct Imaging and Automatic Visual Inspection (AVI) Systems”.
For more information, click here.
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