Dan’s Biz Bookshelf: ‘Born to Create’
It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Marcy's Musings: Engineering Economics
ICT Announces Presenter Lineup for Evening Seminar
November 24, 2017 | Institute of Circuit TechnologyEstimated reading time: Less than a minute
The Institute of Circuit Technology (ICT) Evening Seminar, which will be held December 5, 2018 at the Majestic Hotel in Harrogate, UK, will feature Emma Hudson of UL, Andy Cobley of Coventry University, and Jean-Paul Birraux of First EIE (Geneva) as presenters.
Hudson will present on the topic of solder limits for recognized PCBs and materials. Cobley, meanwhile, will present on a new project, Selective Metallization of Dielectric Substrates Using a Magnetic Field.
Birraux, on the other hand, will give a presentation titled “Developments in Photo-plotters, UV Direct Imaging and Automatic Visual Inspection (AVI) Systems”.
For more information, click here.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/29/2024 | Nolan Johnson, I-Connect007If you’re in the U.S. today, odds are you’re at home enjoying the aftermath of a Thanksgiving holiday meal. Let me just say that whether you had a Thanksgiving holiday surrounded by family, friends, or both, I hope it was joyous. If you know someone who doesn’t have friends or family with whom to share this time, please reach out and include them. Chronic loneliness can exact a measurable toll on our mental and physical health. Wherever you are on the globe this holiday season, I encourage you to reach out to someone who might be battling loneliness and connect. It will make a difference to them. Not only will it help get you in the mood for your winter holiday of choice, but it’ll be good for your mental health as well.
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in